參數(shù)資料
型號(hào): MMSF5N03HDR2
廠商: ON SEMICONDUCTOR
元件分類: JFETs
英文描述: 6.5 A, 30 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: MINIATURE, CASE 751-07, SOP-8
文件頁(yè)數(shù): 1/10頁(yè)
文件大?。?/td> 262K
代理商: MMSF5N03HDR2
Publication Order Number:
MMSF5N03HD/D
Semiconductor Components Industries, LLC, 2006
August, 2006 Rev. 7
1
MMSF5N03HD
Preferred Device
Power MOSFET
5 Amps, 30 Volts
NChannel SO8
These miniature surface mount MOSFETs feature ultra low RDS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
draintosource diode has a very low reverse recovery time.
MiniMOS
t devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dcdc converters, and power management in portable
and battery powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor controls
in mass storage products such as disk drives and tape drives. The
avalanche energy is specified to eliminate the guesswork in designs
where inductive loads are switched and offer additional safety margin
against unexpected voltage transients.
Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery
Life
Logic Level Gate Drive Can Be Driven by Logic ICs
Miniature SO8 Surface Mount Package Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed, With Soft Recovery
IDSS Specified at Elevated Temperature
Avalanche Energy Specified
Mounting Information for SO8 Package Provided
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
30
Vdc
DraintoGate Voltage (RGS = 1.0 MΩ)
VDGR
30
Vdc
GatetoSource Voltage Continuous
VGS
± 20
Vdc
Drain Current Continuous @ TA = 25°C
Drain Current Continuous @ TA = 100°C
Drain Current Single Pulse (tp ≤ 10 μs)
ID
IDM
6.5
4.4
33
Adc
Apk
Total Power Dissipation @ TA = 25°C
(Note 1.)
PD
2.5
Watts
Operating and Storage Temperature Range
TJ, Tstg
55 to
150
°C
Single Pulse DraintoSource Avalanche
Energy Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 5.0 Vdc, Peak
IL = 15 Apk, L = 4.0 mH, RG = 25 Ω)
EAS
450
mJ
Thermal Resistance Junction to Ambient
(Note 1.)
RθJA
50
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
TL
260
°C
1. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided),
10 sec. max.
NC
1
2
3
4
8
7
6
5
Top View
Source
Gate
Drain
1
8
5 AMPERES
30 VOLTS
RDS(on) = 40 mW
Device
Package
Shipping
ORDERING INFORMATION
MMSF5N03HDR2
SO8
2500 Tape & Reel
SO8
CASE 751
STYLE 13
http://onsemi.com
NChannel
LYWW
MARKING
DIAGRAM
D
S
G
S5N03
L
= Location Code
Y
= Year
WW
= Work Week
PIN ASSIGNMENT
Preferred devices are recommended choices for future use
and best overall value.
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