參數(shù)資料
型號(hào): MMDF3N04HDR2
廠商: ON SEMICONDUCTOR
元件分類(lèi): 小信號(hào)晶體管
英文描述: Power MOSFET 3 Amps, 40 Volts
中文描述: 3400 mA, 40 V, 2 CHANNEL, N-CHANNEL, Si, SMALL SIGNAL, MOSFET
封裝: MINIATURE, CASE 751-07, SO-8
文件頁(yè)數(shù): 3/12頁(yè)
文件大?。?/td> 135K
代理商: MMDF3N04HDR2
MMDF3N04HD
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS
(T
C
= 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(V
GS
= 0 Vdc, I
D
= 0.25 mAdc)
Temperature Coefficient (Positive)
(Cpk
2.0)
(Notes 4 & 6)
V
(BR)DSS
40
4.3
Vdc
mV/
°
C
Zero Gate Voltage Drain Current
(V
DS
= 40 Vdc, V
GS
= 0 Vdc)
(V
DS
= 40 Vdc, V
GS
= 0 Vdc, T
J
= 125
°
C)
I
DSS
0.015
0.15
2.5
10
Adc
GateBody Leakage Current (V
GS
=
±
20 Vdc, V
DS
= 0)
I
GSS
0.013
500
nAdc
ON CHARACTERISTICS
(Note 4)
Gate Threshold Voltage
(V
DS
= V
GS
, I
D
= 0.25 mAdc)
Threshold Temperature Coefficient (Negative)
(Cpk
2.0)
(Notes 4 & 6)
V
GS(th)
1.0
2.0
4.9
3.0
Vdc
mV/
°
C
Static DraintoSource OnResistance
(V
GS
= 10 Vdc, I
D
= 3.4 Adc)
(V
GS
= 4.5 Vdc, I
D
= 1.7 Adc)
(Cpk
2.0)
(Notes 4 & 6)
R
DS(on)
55
79
80
100
m
Forward Transconductance (V
DS
= 3.0 Vdc, I
D
= 1.7 Adc)
(Note 4)
g
FS
2.0
4.5
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(V
DS
= 32 Vdc, V
GS
= 0 Vdc,
f = 1.0 MHz)
C
iss
450
900
pF
Output Capacitance
C
oss
130
230
Transfer Capacitance
C
rss
32
96
SWITCHING CHARACTERISTICS
(Note 5)
TurnOn Delay Time
t
d(on)
9.0
18
ns
Rise Time
= 20
= 3.4 Adc,
(V
DD
20
Vdc, I
D
3.4 Adc,
V
GS
= 10 Vdc, R
G
= 6 ) (Note 4)
t
r
15
30
TurnOff Delay Time
t
d(off)
28
56
Fall Time
t
f
19
38
TurnOn Delay Time
t
d(on)
13
26
ns
Rise Time
= 20
= 1.7 Adc,
(V
DD
20
Vdc, I
D
1.7 Adc,
V
GS
= 4.5 Vdc, R
G
= 6 ) (Note 4)
t
r
77
144
TurnOff Delay Time
t
d(off)
17
34
Fall Time
t
f
20
40
Gate Charge
Q
T
13.9
28
nC
= 40 Vdc, I
= 3.4 Adc,
(V
DS
40 Vdc, I
D
3.4 Adc,
V
GS
= 10 Vdc) (Note 4)
Q
1
2.1
Q
2
3.7
Q
3
5.4
SOURCEDRAIN DIODE CHARACTERISTICS
Forward OnVoltage
(I
S
= 3.4 Adc, V
GS
= 0 Vdc) (Note 4)
(I
S
= 3.4 Adc, V
GS
= 0 Vdc,
T
J
= 125
°
C)
V
SD
0.87
0.8
1.5
Vdc
Reverse Recovery Time
(I
S
= 3.4 Adc, V
GS
= 0 Vdc,
dI
S
/dt = 100 A/ s) (Note 4)
3 4 Ad
t
rr
27
ns
t
a
20
t
b
7.0
Reverse Recovery Storage Charge
4. Pulse Test: Pulse Width
300 s, Duty Cycle
2%.
5. Switching characteristics are independent of operating junction temperature.
6. Reflects typical values. C
pk
=
3 x SIGMA
Q
RR
0.03
C
Max limit Typ
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