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參數(shù)資料
| 型號： | MMC2075 |
| 廠商： | Motorola, Inc. |
| 英文描述： | Integrated Processor with Roaming FLEX Decoder |
| 中文描述： | 綜合處理器漫游FLEX解碼器 |
| 文件頁數(shù)： | 29/34頁 |
| 文件大?。?/td> | 768K |
| 代理商： | MMC2075 |
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BGA Details
Pin-out and Package Information
Preliminary
29
Part 4 Pin-out and Package Information
This section provides information about the available packages for this product. The MMC2080/2075 is
available in a 144-pin Ball Grid Array (BGA) package. A 208-pin Pin Grid Array (PGA) is produced for
engineering use only. Contact the factory for availability.
4.1 BGA Details
The MMC2080/2075 is offered in the JEDEC-standard, Mold Array Process (MAP), 12 mm x 12 mm BGA
with 0.8 mm ball pitch (0.4 mm small solder balls). Refer to Figure 8 for the package drawings and
dimensions.
4.1.1
The mechanical drawings for the 144-pin Ball Grid Array package are shown in Figure 8.
BGA Package Mechanical Drawings
Figure 8. MMC2080/2075 BGA Mechanical Drawings
4
Z
VIEW M-M
DETAIL K
M
A
DETAIL K
M
0.15 Z X Y
Z
0.08
3
b
144X
A1
A2
0.10 Z
5
0.20 Z
ROTATED 90 CLOCKWISE
DIM
A
A1
A2
b
D
E
e
MIN
1.25
0.18
1.16 REF
0.35
12.00 BSC
12.00 BSC
0.80 BSC
MAX
1.60
0.34
MILLIMETERS
0.45
NOTES:
1.
2.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
PARALLELISMMEASUREMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
3.
4.
5.
12
e
12X
E
D
LASER MARK FOR PIN 1
IDENTIFICATION IN
X
0.15
METALIZED MARK
FOR PIN 1 IDENTIFICATION
11 10 9
8
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
13
N
e
1
Y
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