參數(shù)資料
型號: MM908E626R2
廠商: 飛思卡爾半導體(中國)有限公司
元件分類: 基準電壓源/電流源
英文描述: Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
中文描述: 集成的步進電機驅(qū)動器,帶有嵌入式微控制器和LIN串行通信
文件頁數(shù): 30/32頁
文件大?。?/td> 303K
代理商: MM908E626R2
908E626
30
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PACKAGE DIMENSIONS
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS B AND C TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF HTE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS SHALL
NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED 0.46 MM. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD SHALL NOT BE LESS THAN
0.07 MM.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.1 MM AND
0.3 MM FROM THE LEAD TIP.
THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTER-LEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTOM
OF THE PLASTIC BODY.
17.8
7.4
1
27
28
54
B
9
5
C
7.6
18.0
9
4
10.3
5.15
0.3
A B C
2X 27 TIPS
B
B
PIN 1 INDEX
C
0.10 A
2.35
SEATING
0.65
A
54X
52X
2.65
0.9
0.5
SECTION B-B
R0.08 MIN
0.1
0.0
0
8
0
0.25
GAUGE PLANE
MIN
(1.43)
A
A
C
C
(0.29)
0.38
0.22
0.30
0.25
(0.25)
PLATING
BASE METAL
ROTATED 90 CLOCKWISE
8
M
0.13
C
A B
6
10.9
9.7
0.30
C
A B
5.3
4.8
0.30
C
A B
VIEW C-C
DWB SUFFIX
54-TERMINAL SOIC WIDE BODY EXPOSED PAD
PLASTIC PACKAGE
CASE 1400-01
ISSUE B
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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