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參數(shù)資料
| 型號： | MM908E626R2 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication |
| 中文描述： | 集成的步進(jìn)電機(jī)驅(qū)動器，帶有嵌入式微控制器和LIN串行通信 |
| 文件頁數(shù)： | 29/32頁 |
| 文件大?。?/td> | 303K |
| 代理商： | MM908E626R2 |
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
908E626
29
FACTORY TRIMMING AND CALIBRATION
To enhance the ease-of-use of the 908E626, various
parameters (e.g. ICG trim value) are stored in the flash memory
of the device. The following flash memory locations are
reserved for this purpose and might have a value different from
the “empty” (0xFF) state:
0xFD80:0xFDDF Trim and Calibration Values
0xFFFE:0xFFFF Reset Vector
In the event the application uses these parameters, one has
to take care not to erase or override these values. If these
parameters are not used, these flash locations can be erased
and otherwise used.
PACKAGE THERMAL PERFORMANCE
Figure 13
shows a thermal response curve for a package
mounted onto a thermally enhanced PCB.
Note
The PCB board is a multi-layer board with two inner
copper planes (2s2p). The board conforms to JEDEC EIA/
JESD 51-5 and JESD51-7. Substrate thickness is 1.60 mm.
Top and bottom copper trace layers are 0.7 mm thick, with two
inner copper planes of 0.35 mm thickness. Thermal vias have
0.35 mm thick plating.
Figure 13. Thermal Response of H-Bridge Driver with Package Soldered to a JEDEC PCB Board
0
5
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30
0.00001 0.0001
0.001
0.01
0.1
Time (s)
10
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time[s]
T
o
/
T
1.0
5.0
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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