參數(shù)資料
型號： MM908E425AIDWB
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication
中文描述： 綜合四半僅符合電源橋，嵌入式微控制器和LIN串行通信
文件頁數(shù)： 46/49頁
文件大小： 490K
代理商： MM908E425AIDWB
Analog Integrated Circuit Device Data
Freescale Semiconductor
46
908E425
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 28. Thermal Test Board
Device on Thermal Test Board
R
θ
JA
is the thermal resistance between die junction and
ambient air.
R
θ
JSmn
is the thermal resistance between die junction and
the reference location on the board surface near a center
lead of the package.
This device is a dual die package. Index
m
indicates the
die that is heated. Index
n
refers to the number of the die
where the junction temperature is sensed.
908E425 Pin Connections
54-Pin SOICW-EP
0.65 mm Pitch
17.9 mm x 7.5 mm Body
10.3 mm x 5.1 mm Exposed Pad
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
RXD
VSS
PA1
VDD
H1
H2
H3
HVDD
NC
HB4
VSUP3
GND2
HB3
HS
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4/OSC1
PTC3/OSC2
PTC2/MCLK
PTB5/AD5
PTB4/AD4
PTB3/AD3
IRQ
RST
PTB1/AD1
PTD0/TACH0/BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
1
2
3
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
9
11
6
7
8
4
5
54
53
52
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
44
48
46
51
49
EPad
A
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area
A
:
Cu heat-spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 15. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm
2
)
1 = Power Chip, 2 = Logic Chip
(
°
C/W)
m
= 1,
n
= 1
m
= 1,
n
= 2
m
= 2,
n
= 1
m
= 2,
n
= 2
R
θ
JA
mn
0
53
48
53
300
39
34
38
600
35
30
34
R
θ
JS
mn
0
21
16
20
300
15
11
15
600
14
9.0
13
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MM908E621 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Quad Half-Bridge and Triple High-Side with Embedded MCU and LIN for High End Mirror
MM908E621_08 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Quad Half-bridge and Triple High Side with Embedded MCU and LIN for High End Mirror
MM908E621ACDWB 功能描述:8位微控制器 -MCU QUAD H-B/3-HS W/MCU & LI RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MM908E621ACDWB/R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Quad Half-bridge and Triple High Side with Embedded MCU and LIN for High End Mirror
MM908E621ACDWBR2 功能描述:8位微控制器 -MCU QUAD HB / TRIPLE HS 841B RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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