參數(shù)資料
型號： MCIMX258CVM4
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
封裝： 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
文件頁數(shù)： 68/154頁
文件大?。?/td> 1498K
代理商： MCIMX258CVM4
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
20
Freescale Semiconductor
Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
Mold compound: Generic mold compound; k = 0.9 W/m K
3.5
I/O DC Parameters
This section includes the DC parameters of the following I/O types:
DDR I/O: Mobile DDR (mDDR), double data rate (DDR2), or synchronous dynamic random
access memory (SDRAM)
General purpose I/O (GPIO)
NOTE
The term ‘OVDD’ in this section refers to the associated supply rail of an
input or output. The association is shown in the “Signal Multiplexing”
chapter of the reference manual.
3.5.1
DDR I/O DC Parameters
The DDR pad type is configured by the IOMUXC_SW_PAD_CTL_GRP_DDRTYPE register (see the
External Signals and Pin Multiplexing chapter of the i.MX25 Reference Manual for details).
Table 16. Thermal Resistance Data
Rating
Condition
Symbol
Value
Unit
Junction to ambient1 natural convection
1 Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
Single layer board (1s)
ReJA
55
°C/W
Junction to ambient1 natural convection
Four layer board (2s2p)
ReJA
33
°C/W
Junction to ambient1 (@200 ft/min)
Single layer board (1s)
ReJMA
46
°C/W
Junction to ambient1 (@200 ft/min)
Four layer board (2s2p)
ReJMA
29
°C/W
Junction to boards2
2 Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for
this package.
—ReJB
22
°C/W
Junction to case (top)3
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
—ReJCtop
13
°C/W
Junction to package top4
4 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
Natural convection
Ψ
JT
2°C/W
相關(guān)PDF資料
PDF描述
MD80C154-36/883D 8-BIT, 36 MHz, MICROCONTROLLER, CDIP40
MQ80C52TXXX-16P883D 8-BIT, MROM, 16 MHz, MICROCONTROLLER, CQFP44
MC80C52XXX-30/883:D 8-BIT, MROM, 30 MHz, MICROCONTROLLER, CDIP40
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MD80C154-20P883 8-BIT, 20 MHz, MICROCONTROLLER, CDIP40
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCIMX25LPDK 制造商:Freescale Semiconductor 功能描述:PRODUCT DEVELOPMENT KIT FOR THE I MX25 APPLICATIONS PROCESSO - Boxed Product (Development Kits) 制造商:Freescale Semiconductor 功能描述:KIT DEV I.MX25 FOR LINUX 制造商:Freescale 功能描述:Product Development Kit For The I.MX25 Applications Processor
MCIMX25LPDKJ 功能描述:開發(fā)板和工具包 - ARM HARDWARE RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
MCIMX25LPDKJ 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE
MCIMX25PDKCPUJ 功能描述:開發(fā)板和工具包 - ARM CPU BD, MX25, LINUXJ RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
MCIMX25WPDK 功能描述:開發(fā)板和工具包 - ARM MCIMX25 PDK ForLINUX RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
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