參數(shù)資料
型號： MCF5232CAB80
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Integrated Microprocessor Hardware Specification
中文描述： 集成的微處理器，硬件規(guī)格
文件頁數(shù)： 11/46頁
文件大小： 988K
代理商： MCF5232CAB80
Design Recommendations
MCF523x Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
11
5.2.1.2
Power Down Sequence
If V
DD
/PLLV
DD
are powered down first, then sense circuits in the I/O pads will cause all output drivers to
be in a high impedance state. There is no limit on how long after V
DD
and PLLV
DD
power down before
OV
DD
must power down. V
DD
should not lag OV
DD
or PLLV
DD
going low by more than 0.4 V during
power down or there will be undesired high current in the ESD protection diodes. There are no
requirements for the fall times of the power supplies.
The recommended power down sequence is as follows:
1. Drop V
DD
/PLLV
DD
to 0 V.
2. Drop OV
DD
supplies.
5.3
Decoupling
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
0.1
μ
F and 0.01
μ
F at each supply input
5.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See
Section 7, “Preliminary Electrical Characteristics
.”
5.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
5.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
相關(guān)PDF資料
PDF描述
MCF5232 Integrated Microprocessor Hardware Specification
MCF5249 CodeWarrior Development Studio for ColdFire㈢ Architectures
MCF5251_07 ColdFire㈢ Microprocessor Data Sheet
MCF5251 ColdFire Processor
MCF5253 ColdFire㈢ Microprocessor Data Sheet
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF5232CVM100 功能描述:微處理器 - MPU MCF5232 V2CORE 64KSRAM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MCF5232CVM100 制造商:Freescale Semiconductor 功能描述:Microprocessor IC
MCF5232CVM100J 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5232CVM150 功能描述:微處理器 - MPU MCF5232 V2CORE 64KSRAM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MCF5232CVM150J 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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