參數(shù)資料
型號： MCC3E0RX180WB0B
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 180 MHz, RISC PROCESSOR, CBGA728
封裝： 29 X 29 MM, 4 MM HEIGHT, 1 MM PITCH, CERAMIC, FCBGA-728
文件頁數(shù)： 97/120頁
文件大?。?/td> 1633K
代理商： MCC3E0RX180WB0B
78
CHAPTER 3: ELECTRICAL SPECIFICATIONS
C3ENPA1-DS/D REV 03
MOTOROLA GENERAL BUSINESS INFORMATION
θ
jc is the junction-to-case thermal resistance
θ
int is the adhesive or interface material thermal resistance
θ
sa is the heat sink base-to-ambient thermal resistance
P
d is the power dissipated by the device
During operation, the die-junction temperatures (T
j ) should be maintained less than the
value specified in Table 36. The temperature of the air cooling the component greatly
depends upon the ambient inlet air temperature and the air temperature rise within the
electronic cabinet. An electronic cabinet inlet-air temperature (T
a ) may range from 30° to
40°C. The air temperature rise within a cabinet (T r ) may be in the range of 5° to 10°C. The
thermal resistance of the thermal interface material (
θ
int ) is typically about 1.5°C/W. For
example, assuming a T
a of 30°C, a T r of 5°C, a CBGA package θjc = 0.1, and a maximum
power consumption (P
d ) of 7.5 W, the following expression for T j is obtained:
Die-junction temperature: T
j = 30°C + 5°C + (0.1°C/W + 1.5°C/W + θsa ) x 7.5 W
For this example, a
θ
sa value of 10.4°C/W or less is required to maintain the die junction
temperature below the maximum value of Table 36.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are
a common figure-of-merit used for comparing the thermal performance of various
microelectronic packaging technologies, one should exercise caution when only using
this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating
temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power
consumption, a number of factors affect the final operating die-junction
temperature—airflow, board population (local heat flux of adjacent components), heat
sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for
today's microelectronic equipment, the combined effects of the heat transfer
mechanisms (radiation, convection,and conduction) may vary widely. For these reasons,
we recommend using conjugate heat transfer models for the board, as well as
system-level designs.
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
相關(guān)PDF資料
PDF描述
MCCF68HC08LK60 8-BIT, FLASH, 4 MHz, MICROCONTROLLER, UUC150
MCW68HC08LK60 8-BIT, FLASH, 4 MHz, MICROCONTROLLER, UUC150
MCD214FU 768 X 560 PIXELS CRT GRPH DSPL CTLR, PQFP160
MCF5102PV20A 32-BIT, 20 MHz, RISC PROCESSOR, PQFP144
MCF5102PV16A 32-BIT, 16.67 MHz, RISC PROCESSOR, PQFP144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCC-4 制造商:MEC A/S 功能描述:CLAMP GROUNDING PLASTIC 3.5 制造商:MEC A/S 功能描述:CLAMP, GROUNDING, PLASTIC, 3.5MM 制造商:MEC A/S 功能描述:CLAMP, GROUNDING, PLASTIC, 3.5MM; SVHC:No SVHC (18-Jun-2012) ;RoHS Compliant: Yes
MCC400M10 制造商:Thomas & Betts 功能描述:METRIC CONNECTOR 400SQMM M10 STUD
MCC400M12 制造商:Thomas & Betts 功能描述:METRIC CONNECTOR 400SQMM M12 STUD
MCC400M14 制造商:Thomas & Betts 功能描述:METRIC CONNECTOR 400SQMM M14 STUD
MCC400M16 制造商:Thomas & Betts 功能描述:METRIC CONNECTOR 400SQMM M16 STUD
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*