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參數(shù)資料
| 型號(hào)： | MCC3E0RX180WB0B |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 180 MHz, RISC PROCESSOR, CBGA728 |
| 封裝： | 29 X 29 MM, 4 MM HEIGHT, 1 MM PITCH, CERAMIC, FCBGA-728 |
| 文件頁數(shù)： | 94/120頁 |
| 文件大?。?/td> | 1633K |
| 代理商： | MCC3E0RX180WB0B |
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Power and Thermal Characteristics
75
MOTOROLA GENERAL BUSINESS INFORMATION
C3ENPA1-DS/D REV 03
Power and Thermal
Characteristics
Table 36 provides the derived power and thermal characteristics for the production
version of the C-3e NP.
note: Power dissipation values assume the following conditions:
BMU memory operating at 125MHz
TLU memory operating at 125MHz
QMU operating at 150MHz
VDD = 1.1V, VDD33/VDDT = 3.3V, TJ at approximately 50°C for typical values. VDD and
VDD33/VDDT are 5% higher for maximum values
“Minimum” PD based on idle condition (clocks running and no programs executing)
“Typical” PD based on test application that implements Fast Ethernet forwarding
actively running on all CPs
“Maximum” PD based on maximum consumption for any high-bandwidth
communications application executing on all CPs, FP, and XP
Thermal Management
Information
This section provides thermal management information for the ceramic ball grid array
(CBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent on the system-level design—the heat sink, airflow, and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods—spring clip to holes in the printed-circuit board or package,
and mounting clip and screw assembly (refer to Figure 10); however, due to the potential
Table 36 C-3e Network Processor Power and Thermal Characteristics
PARAMETER
MIN
TYP
MAX
UNITS
TEST CONDITIONS
Power Dissipation, P
D
2.5
5.5
7.5
W
180MHz core clock
See Note below
Maximum Junction
Temperature, T
J
125
oC
See Note below
Thermal Resistance, junction
to case,
θ
JC
<0.1
oC/W
See Note below
Thermal Resistance, junction
to printed circuit board,
θ
JB
5.5
oC/W
See Note below
F
re
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sc
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m
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d
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c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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