參數(shù)資料
型號: MCC3E0RX180WB0B
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 180 MHz, RISC PROCESSOR, CBGA728
封裝: 29 X 29 MM, 4 MM HEIGHT, 1 MM PITCH, CERAMIC, FCBGA-728
文件頁數(shù): 10/120頁
文件大?。?/td> 1633K
代理商: MCC3E0RX180WB0B
Reflow
107
MOTOROLA GENERAL BUSINESS INFORMATION
C3ENPA1-DS/D REV 03
Reflow
Typical Reflow Profile for the C-3e Switch Module comprises:
1 Follow the guidelines recommended by your solder paste supplier.
Flux requirements must be met for best solderability.
2 The temperature profile should be carefully characterized to ensure uniform
temperature across the board and package.
Solder ball voiding may be affected by ramp rates and dwell times below and above
liquids.
3 A nitrogen atmosphere is not required, but will make the process more robust. It can
make a difference for marginally solderable PC board pads.
4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
be used.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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