參數(shù)資料
型號(hào)： MC9S12DG256B
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： device made up of standard HCS12 blocks and the HCS12 processor core
中文描述： 設(shè)備組成水平的HCS12塊和HCS12的處理器核心
文件頁數(shù)： 2/128頁
文件大小： 2560K
代理商： MC9S12DG256B
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
DOCUMENT NUMBER
9S12DP256BDGV2/D
2
Revision History
Version
Number
Revision
Date
29 MAR
2001
Effective
Date
29 MAR
2001
Author
Description of Changes
V01.00
Initial version.
V01.01
8 MAY
2001
8 MAY
2001
VDD5 spec change 4.5V . . 5.25V
Current Injection on single pin +- 2.5mA
added DC bias level on EXTAL pin
minor cosmetics and corrected typos
changed ATD Electrical Characteristics seperate coupling ratio for
positive and negative bulk current injection
added pinout for 80QFP
corrected SPI timing
V02.00
16 May
2001
16 May
2001
V02.01
5 June
2001
14 June
2001
18 June
2001
corrected Expanded Bus Timing Characteristics
V02.02
Some corrections on pin usage after review
V02.03
Minor corrections with respect to format and wording
Added SRAM data retention disclaimer
Changed Oscillator Characteristics t
CQOUT
max 2.5s and replaced
Clock Monitor Time-out by Clock Monitor Failure Assert Frequency
Changed Self Clock Mode Frequency min 1MHz and max 5.5MHz
Changed I
DDPS
(RTI and COP disabled) to 400uA
Corrected f
ref
and REFDV/SYNR Settings for PLL Stabilization
Delay Measurements, added t
EXTR
and t
EXTF
to Oscillator
Characteristics, Corrected t
EXTL
and t
EXTH
values
Added thermal resistance for LQFP 80, added PCB layout proposal
for power and ground connections
Added Document Names
Variable definitions and Names have been hidden
Added Maskset 1K79X
Modified description in chapter A.5.2 Oscillator
V02.04
26 June
2001
V02.05
11 July
2001
V02.06
17 July
2001
V02.07
24 July
2001
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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MC9S12DG256BCFU 功能描述:16位微控制器 - MCU 16 Bit 25MHz RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MC9S12DG256BCPV 功能描述:IC MCU 256K FLASH 25MHZ 112-LQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:HCS12 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
MC9S12DG256BMFU 功能描述:16位微控制器 - MCU 16 Bit 25MHz RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MC9S12DG256BMPV 功能描述:IC MCU 256K FLASH 25MHZ 112-LQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:HCS12 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
MC9S12DG256BVPV 功能描述:16位微控制器 - MCU 16 Bit 25MHz RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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