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| 型號(hào)： | MC7457VG867NC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA483 |
| 封裝： | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-483 |
| 文件頁(yè)數(shù)： | 5/73頁(yè) |
| 文件大?。?/td> | 1715K |
| 代理商： | MC7457VG867NC |
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MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
Freescale Semiconductor
13
Electrical and Thermal Characteristics
Table 4 provides the recommended operating conditions for the MPC7457.
Table 5 provides the package thermal characteristics for the MPC7457.
Table 4. Recommended Operating Conditions 1
Characteristic
Symbol
Recommended Value
Unit
Notes
Min
Max
Core supply voltage
VDD
1.3 V ± 50 mV
V
PLL supply voltage
AVDD
1.3 V ± 50 mV
V
2
Processor bus supply voltage
BVSEL = 0
OVDD
1.8 V ± 5%
V
BVSEL = HRESET or OVDD
OVDD
2.5 V ± 5%
V
L3 bus supply voltage
L3VSEL = 0
GVDD
1.8 V ± 5%
V
L3VSEL = HRESET or GVDD
GVDD
2.5 V ± 5%
V
L3VSEL = HRESET
GVDD
1.5 V ± 5%
V
3
Input voltage
Processor bus
Vin
GND
OVDD
V
L3 bus
Vin
GND
GVDD
V
JTAG signals
Vin
GND
OVDD
V
Die-junction temperature
Tj
0105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. This voltage is the input to the filter discussed in Section 9.2, “PLL Power Supply Filtering,” and not necessarily the voltage
at the AVDD pin, which may be reduced from VDD by the filter.
3. HRESET is the inverse of HRESET.
Table 5. Package Thermal Characteristics 1
Characteristic
Symbol
Value
Unit
Notes
MPC7447
MPC7457
Junction-to-ambient thermal resistance, natural convection
RθJA
22
20
°C/W
2, 3
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
RθJMA
14
°C/W
2, 4
Junction-to-ambient thermal resistance, 200 ft/min airflow,
single-layer (1s) board
RθJMA
16
15
°C/W
2, 4
Junction-to-ambient thermal resistance, 200 ft/min airflow,
four-layer (2s2p) board
RθJMA
11
°C/W
2, 4
Junction-to-board thermal resistance
RθJB
66
°C/W
5
Junction-to-case thermal resistance
RθJC
<0.1
°C/W
6
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