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參數(shù)資料
| 型號(hào)： | MC7455ARX1000LG |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA483 |
| 封裝： | 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件頁(yè)數(shù)： | 51/76頁(yè) |
| 文件大?。?/td> | 1520K |
| 代理商： | MC7455ARX1000LG |
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MOTOROLA
MPC7455 RISC Microprocessor Hardware Specifications
55
System Design Information
1.9.8
Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 25); however, due to the potential large mass
of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used, the spring
force should not exceed 10 pounds.
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7455. There are
several commercially available heat sinks for the MPC7455 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
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