參數(shù)資料
型號: MC68HSC05P1AP
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 4 MHz, MICROCONTROLLER, PDIP28
封裝: PLASTIC, DIP-28
文件頁數(shù): 10/124頁
文件大小: 623K
代理商: MC68HSC05P1AP
MC68HC05P1A Rev. 3.0
General Release Specification
MOTOROLA
Mechanical Specifications
107
NON-DISCLOSURE
AGREEMENT
REQUIRED
General Release Specification — MC68HC05P1A
Section 11. Mechanical Specifications
11.1 Contents
11.2 Introduction
This section gives the dimensions of the dual in-line package (DIP) and
the small outline integrated circuit (SOIC) package.
11.3 Dual In-Line Package (Case 710)
0.100 BSC
0.600 BSC
2.54 BSC
15.24 BSC
MIN
MAX
MILLIMETERS
INCHES
DIM
36.45
13.72
3.94
0.36
1.02
1.65
0.20
2.92
0.51
37.21
14.22
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
15°
0.040
A
B
C
D
F
G
H
J
K
L
M
N
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
114
15
28
B
A
C
N
K
M
J
D
SEATING
PLANE
F
HG
L
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