參數(shù)資料
型號： MC68HC705E6
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： HCMOS Microcontroller Unit
中文描述： HCMOS微控制器
文件頁數(shù)： 107/140頁
文件大?。?/td> 788K
代理商： MC68HC705E6
Electrical Specifications
Thermal characteristics and power considerations
MC68HC05E6 — Rev. 1.0
Electrical Specifications
For More Information On This Product,
Go to: www.freescale.com
Thermal characteristics and power considerations
The average chip junction temperature, T
J
, in degrees Celcius can be
obtained from the following equation:
[1]
where:
T
A
= Ambient temperature (
°
C)
θ
JA
= Package thermal resistance, junction-to-ambient (
°
C/W)
P
D
= P
INT
+ P
I/O
(W)
P
INT
= Internal chip power = I
DD
V
DD
(W)
P
I/O
= Power dissipation on input and output pins (user determined)
An approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is:
[2]
Solving equations [1] and [2] for K gives:
[3]
where K is a constant for a particular part. K can be determined by
measuring P
D
(at equilibrium) for a known T
A
. Using this value of K, the
values of P
D
and T
J
can be obtained for any value of T
A
by solving the
above equations. The package thermal characteristics are shown in
Table 20
.
Table 20 Package thermal characteristics
Characteristics
Symbol
Value
Unit
Thermal resistance
– Plastic 44 pin QFP package
– Plastic 28 pin SOIC package
θ
JA
θ
JA
60
60
°
C/W
°
C/W
T
J
T
A
P
D
θ
JA
(
)
+
=
P
D
K
+
T
J
273
--------------------
=
K
P
D
T
A
273
+
(
)
θ
JA
P
D2
+
=
Figure 29 Equivalent test load
V
DD
= 4.5 V
R2
R1
C
Test
point
Pins
R1
R2
C
PA0–7, PB0–7, PC0–7, PD0–7, PG0–3
3.26k
2.38k
50pF
3-elec
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料
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