參數(shù)資料
型號： MC68HC705C9AP
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP40
封裝： PLASTIC, DIP-40
文件頁數(shù)： 58/177頁
文件大小： 1941K
代理商： MC68HC705C9AP
Mechanical Specifications
Advance Information
MC68HC705C9A — Rev. 4.0
150
Mechanical Specifications
MOTOROLA
13.6 44-Lead Quad Flat Pack (QFP) (Case 824A-01)
Figure 13-4. 44-Lead QFP (Case 824A-01)
MIN
MAX
MILLIMETERS
INCHES
DIM
0.031 BSC
0.315 REF
0.063 REF
0.80 BSC
8.00 REF
1.6 REF
0.01 (0.004)
L
-D-
BV
A
S
M
C
H
SEATING
PLANE
-C-
G
M
-H- DATUM
PLANE
-A-
L
DETAIL A
33
23
34
44
22
12
111
-B-
E
B
-A,B,D-
-H-
J
K
M
W
D
F
N
R
T
Q
BASE METAL
X
SECTION B–B
DETAIL A
DETAIL C
DATUM
PLANE
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
T
U
V
W
X
9.90
2.10
0.30
2.00
0.30
0.13
0.65
5°
0.13
0°
0.13
12.95
0.13
0°
12.95
0.40
10.10
2.45
0.45
2.10
0.40
0.25
0.23
0.95
10°
0.17
7°
0.30
13.45
0.390
0.083
0.012
0.079
0.012
0.005
0.026
5°
0.005
0°
0.005
0.510
0.005
0°
0.510
0.016
0.398
0.096
0.018
0.083
0.016
0.010
0.009
0.037
10°
0.007
7°
0.012
0.530
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE H IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS A, B AND D TO BE DETERMINED AT
DATUM PLANE H.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE C.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCHAND ARE DETERMINED
AT DATUM PLANE H.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
C
0.20 (0.008)
A-B
D
S
M
H
0.20 (0.008)
A-B
D
S
M
C
0.20 (0.008)
A-B
D
A-B
0.05 (0.002)
S
M
0.20
(0.008)
C
A-B
D
0.05
(0.002)
A-B
M
S
0.20
(0.008)
HA-B
D
M
S
DETAIL C
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