MC68HC705C9A — Rev. 4.0
Advance Information
MOTOROLA
Mechanical Specifications
147
Advance Information — MC68HC705C9A
Section 13. Mechanical Specifications
13.1 Contents
13.2 Introduction
This section describes the dimensions of the plastic dual in-line package
(DIP), plastic shrink dual in-line package (SDIP), plastic leaded chip
carrier (PLCC), and quad flat pack (QFP) MCU packages.
Package dimensions available at the time of this publication are
provided in this section.
To make sure that you have the latest case outline specifications,
contact one of the following:
Local Motorola Sales Office
World Wide Web at
Follow World Wide Web on-line instructions to retrieve the current
mechanical specifications.