參數(shù)資料
型號: MC68HC705C9ACS
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, UVPROM, 2.1 MHz, MICROCONTROLLER
文件頁數(shù): 39/177頁
文件大小: 1941K
代理商: MC68HC705C9ACS
Electrical Specifications
Thermal Characteristics
MC68HC705C9A — Rev. 4.0
Advance Information
MOTOROLA
Electrical Specifications
133
12.4 Thermal Characteristics
12.5 Power Considerations
The average chip-junction temperature, T
J, in °C, can be obtained from:
TJ = TA + (PD × θJA)
(1)
where:
T
A = Ambient temperature, °C
θ
JA = Package thermal resistance, junction to ambient, °C/W
P
D = PINT + PI
/O
P
INT = IDD × VDD watts (chip internal power)
P
I
/O = Power dissipation on input and output pins (user determined)
For most applications P
I
/O PINT and can be neglected.
The following is an approximate relationship between P
D and TJ
(neglecting P
J):
P
D = K ÷ (TJ + 273 °C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D × (TA + 273 °C) + θJA × (PD)
2
(3)
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring P
D (at equilibrium) for a
known T
A. Using this value of K, the values of PD and TJ can be obtained
by solving equations (1) and (2) iteratively for any value of T
A.
Characteristic
Symbol
Value
Unit
Thermal resistance plastic dual in-line (PDIP)
θ
JA
60
°C/W
Thermal resistance plastic leaded chip carrier
(PLCC)
θ
JA
70
°C/W
Thermal resistance quad flat pack (QFP)
θ
JA
95
°C/W
Thermal resistance plastic shrink DIP (SDIP)
θ
JA
60
°C/W
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