參數(shù)資料
型號(hào)： MB91F463NCPMC-GSE1
廠(chǎng)商： FUJITSU LTD
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP64
封裝： 12 X 12 MM, 1.70 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, LQFP-64
文件頁(yè)數(shù)： 8/84頁(yè)
文件大?。?/td> 1954K
代理商： MB91F463NCPMC-GSE1
MB91460N Series
16
DS07-16607-4E
2.
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mounting type. In either case, quality assurance
of heat resistance are applied for mounting under the Fujitsu's recommended conditions only at the soldering
stage. For detailed information on mount conditions, contact the sales representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board
and using the flow soldering (wave soldering) method of applying liquid solder.
In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the
absolute ratings for storage temperature. Mounting processes should conform to FUJITSU recommended mount-
ing conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead
to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket
contacts and IC leads be verified before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. FUJITSU recommends the solder reflow method, and has
established a ranking of mounting conditions for each product. Users are advised to mount packages in accor-
dance with FUJITSU ranking of recommended conditions.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will
cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture
can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the
following:
(a) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store
products in locations where temperature changes are slight.
(b) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temper-
atures between
+ 5 °C to + 30 °C.
(c) When necessary, FUJITSU packages semiconductor devices in highly moisture-resistant aluminum laminate
bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.
(d) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
相關(guān)PDF資料
PDF描述
MB91F464AAPMC-GSE2 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100
MB91F464AA 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100
MB91F465CAPMC-GSE2 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP144
MB91F466BA 32-BIT, FLASH, 96 MHz, RISC MICROCONTROLLER, PQFP144
MB91F464BA 32-BIT, FLASH, 96 MHz, RISC MICROCONTROLLER, PQFP144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MB91F464ABPMCR-GSE2 制造商:FUJITSU 功能描述:MCU 32BIT FR 416K FLASH 100LQFP
MB91F464BB 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:32-bit Microcontroller
MB91F464HB 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:32-bit Microcontroller
MB91F464HBPMC-GSE2 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:32-bit Microcontroller
MB91F465BB 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:32-bit Microcontroller
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*