參數(shù)資料
型號: MAX9888EWY+T
廠商: Maxim Integrated Products
文件頁數(shù): 17/115頁
文件大?。?/td> 0K
描述: IC CODEC AUDIO FLEXSOUND 63WLP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
系列: DirectDrive®, FLEXSOUND™
類型: D 類
輸出類型: 3 通道,帶立體聲耳機(jī)
在某負(fù)載時最大輸出功率 x 通道數(shù)量: 1.37W x 2 @ 8 歐姆; 40mW x 2 @ 16 歐姆
電源電壓: 2.8 V ~ 5.5 V
特點(diǎn): 消除爆音,差分輸入,I²S,麥克風(fēng),靜音,關(guān)機(jī)
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 63-WLP
封裝/外殼: 63-WFBGA,WLCSP
包裝: 帶卷 (TR)
配用: MAX9888EVKIT+-ND - KIT EVALUATION FOR MAX9888
Stereo Audio CODEC
with FlexSound Technology
MAX9888
113
Route microphone signals from the microphone to the IC
as a differential pair, ensuring that the positive and nega-
tive signals follow the same path as closely as possible
with equal trace length. When using single-ended micro-
phones or other single-ended audio sources, ground the
negative microphone input as close as possible to the
audio source and then treat the positive and negative
traces as differential pairs.
An evaluation kit (EV kit) is available to provide an exam-
ple layout for the IC. The EV kit allows quick setup of the
IC and includes easy-to-use software allowing all internal
registers to be controlled.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, refer to the Application Note 1891: Wafer-
Level Packaging (WLP) and Its Applications. Figure 43
shows the dimensions of the WLP balls used on the IC.
Figure 43. WLP Ball Dimensions
0.24mm
0.21mm
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