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參數(shù)資料
| 型號(hào)： | MADP-042405-130600 |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | CASE ODS-1306, 2 PIN |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 76K |
| 代理商： | MADP-042405-130600 |
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
3
V2
MADP-042005 Series
SURMOUNT TM 5
m PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and
skin oils.
The use of plastic tipped tweezers or vacuum pickups is strongly recommended for
individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active
junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80 Au / 20 Sn @ ~ + 280 °C or Sn 60 / Pb 40 ~ + 185 °C solder is recommended. Conductive silver epoxy for
die attachment ~ + 150 °C may also be used for lower Incident power ( < 1 W Average Power ) applications.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top
surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal
stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since
the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected
through the die after attach is completed.
A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface
Mounting Instructions “ on the MA-COM website www.macom.com
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MADP-042405-13060G | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diodes |
| MADP-042405-13060P | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diodes |
| MADP-042405-13060T | 制造商:M/A-COM Technology Solutions 功能描述:DIODE, PIN - Tape and Reel |
| MADP-042408-13060 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM 8μM PIN Diodes |
| MADP-042408-13060G | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM 8μM PIN Diodes |
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