參數(shù)資料
型號: MAAPGM0064-DIE
英文描述: Amplifier, Power, 2.0 W 6.5-9.5 GHz
中文描述: 放大器,電源,2.0糯6.5-9.5千兆赫
文件頁數(shù): 5/5頁
文件大?。?/td> 251K
代理商: MAAPGM0064-DIE
Amplifier, Power, 2.0 W
6.5—9.5 GHz
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
MAAPGM0064-DIE
Rev —
Preliminary Information
5
RoHS
Compliant
Figure 4. Recommended operational configuration. Wire bond as shown
.
Assembly Instructions:
Die Attach:
Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than
7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding:
Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V
GG
before applying positive bias to V
DD
to prevent
damage to amplifier.
Die Handling:
Refer to Application Note AN3016.
100-
200
pF
100-
200
pF
RF
OUT
RF
IN
V
DD
0.01-0.1
μ
F
0.01-0.1
μ
F
0.01-0.1
μ
F
0.01-0.1
μ
F
100-
200
pF
100-
200
pF
V
GG
40
Ω
Assembly and Bonding Diagram
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