M37281MAH–XXXSP,M37281MFH–XXXSP,M37281MKH–XXXSP, M37281EKSP
Rev.1.01 2003.07.16 page 2 of 170
TABLE OF CONTENTS
1. DESCRIPTION ..........................................................................1
2. FEATURES................................................................................1
3. APPLICATION ...........................................................................1
4. PIN CONFIGURATION..............................................................3
5. FUNCTIONAL BLOCK DIAGRAM .............................................4
6. PERFORMANCE OVERVIEW ..................................................5
7. PIN DESCRIPTION ...................................................................7
8. FUNCTIONAL DESCRIPTION ................................................ 11
8.1 CENTRAL PROCESSING UNIT (CPU)............................. 11
8.2 MEMORY ..........................................................................12
8.3 INTERRUPTS....................................................................21
8.4 TIMERS .............................................................................26
8.5 SERIAL I/O ........................................................................30
8.6 MULTI-MASTER I2C-BUS INTERFACE ...........................33
8.7 PWM OUTPUT CIRCUIT ..................................................46
8.8 A-D CONVERTER .............................................................50
8.9 ROM CORRECTION FUNCTION .....................................54
8.10 DATA SLICER ..................................................................55
8.11 OSD FUNCTIONS ...........................................................66
8.11.1 Triple Layer OSD...................................................71
8.11.2 Display Position.....................................................74
8.11.3 Dot Size.................................................................78
8.11.4 Clock for OSD .......................................................79
8.11.5 Field Determination Display ..................................81
8.11.6 Memory for OSD ...................................................83
8.11.7 Character Color.....................................................91
8.11.8 Character Background Color.................................91
8.11.9 OUT1, OUT2 Signals ............................................95
8.11.10 Attribute ...............................................................96
8.11.11 Automatic Solid Space Function........................101
8.11.12 Multiline Display ................................................102
8.11.13 SPRITE OSD Function......................................103
8.11.14 Window Function...............................................107
8.11.15 Blank Function .................................................108
8.11.16 Raster Coloring Function .................................. 113
8.11.17 Scan Mode ........................................................115
8.11.18 OSD Output Pin Control.................................... 116
8.12. SOFTWARE RUNAWAY DETECT FUNC-TION .......... 117
8.13. RESET CIRCUIT ..........................................................118
8.14 CLOCK GENERATING CIRCUIT .................................. 119
8.15. DISPLAY OSCILLATION CIRCUIT...............................122
8.16. AUTO-CLEAR CIRCUIT ...............................................122
8.17. ADDRESSING MODE ..................................................122
8.18. MACHINE INSTRUCTIONS .........................................122
9. PROGRAMMING NOTES......................................................122
10. ABSOLUTE MAXIMUM RATINGS .......................................123
11. RECOMMENDED OPERATING CONDITIONS ...................123
12. ELECTRIC CHARACTERISTICS ........................................124
13. ANALOG R, G, B OUTPUT CHARACTERISTICS...............126
14. A-D CONVERTER CHARACTERISTICS.............................126
15.
MULTI-MASTER I2C-BUS BUS LINE CHARACTERISTICS .........
127
16. PROM PROGRAMMING METHOD.....................................128
17. DATA REQUIRED FOR MASK ORDERS ............................129
18. APPENDIX ...........................................................................130
19. PACKAGE OUTLINE ...........................................................170