參數(shù)資料
型號： M30825MW-XXXGP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, MROM, 30 MHz, MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
文件頁數(shù)： 48/48頁
文件大?。?/td> 847K
代理商： M30825MW-XXXGP
Absolute Maximum Ratings
(Notes 1, 2)
Supply Voltage (V
A, VDR)
2.2V
Supply Difference
V
DR - VA
0V to 100 mV
Voltage on Any Input Pin
0.15V to (V
A +0.15V)
Voltage on V
IN
+
, V
IN
-
(Maintaining Common Mode)
0.15V to 2.5V
Ground Difference
|GND - DR GND|
0V to 100 mV
Input Current at Any Pin (Note 3)
±25 mA
Package Input Current (Note 3)
±50 mA
Junction Temperature
≤ 175°C
ESD Susceptibility (Note 4)
Human Body Model
Class 3A (6000V)
Storage Temperature
65°C to +175°C
Operating Ratings (Notes 1, 2)
Ambient Temperature Range
55°C
≤ T
A ≤ +125°C
V
A/2 Tolerance for supply 1.9V
650mV
≥ V
A/2 ≤ 1.2V
Supply Voltage (V
A)
+1.8V to +2.0V
Driver Supply Voltage (V
DR)
+1.8V to V
A
V
IN+, VIN- Voltage Range
(Maintaining Common Mode)
0V to 2.15V
(100% duty cycle)
0V to 2.5V
(10% duty cycle)
Ground Difference
(|GND - DR GND|)
0V
CLK Pins Voltage Range
0V to V
A
Differential CLK Amplitude
0.4V
P-P to 2.0VP-P
Package Thermal Resistance
Package
θ
JA
θ
JC
Top of
Package
θ
JC
Thermal
Pad
128L Cer Quad
Gullwing
11.5°C/ W
3.8°C/ W
2.0°C/ W
Soldering
process
must
comply
with
National
Semiconductor’s Reflow Temperature Profile specifications.
Refer to www.national.com/packaging.
Quality Conformance Inspection
MIL-STD-883, Method 5005 - Group A
Subgroup
Description
Temp ( C)
1
Static tests at
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
10
Switching tests at
+125
11
Switching tests at
-55
12
Setting time at
+25
13
Setting time at
+125
14
Setting time at
-55
9
www.national.com
ADC08D1520QML
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