參數(shù)資料
型號: M25PX32-VMW6F
廠商: 意法半導體
元件分類: DRAM
英文描述: 4 Mbit Uniform Sector, Serial Flash Memory
中文描述: 4兆位統(tǒng)一部門,串行閃存
文件頁數(shù): 48/63頁
文件大小: 394K
代理商: M25PX32-VMW6F
Instructions
M25PX32
48/63
6.19
Release from Deep Power-down (RDP)
Once the device has entered the Deep Power-down mode, all instructions are ignored
except the Release from Deep Power-down (RDP) instruction. Executing this instruction
takes the device out of the Deep Power-down mode.
The Release from Deep Power-down (RDP) instruction is entered by driving Chip Select (S)
Low, followed by the instruction code on Serial Data input (DQ0). Chip Select (S) must be
driven Low for the entire duration of the sequence.
The instruction sequence is shown in
Figure 27
.
The Release from Deep Power-down (RDP) instruction is terminated by driving Chip Select
(S) High. Sending additional clock cycles on Serial Clock (C), while Chip Select (S) is driven
Low, cause the instruction to be rejected, and not executed.
After Chip Select (S) has been driven High, followed by a delay, t
RDP
, the device is put in the
Standby mode. Chip Select (S) must remain High at least until this period is over. The
device waits to be selected, so that it can receive, decode and execute instructions.
Any Release from Deep Power-down (RDP) instruction, while an Erase, Program or Write
cycle is in progress, is rejected without having any effects on the cycle that is in progress.
Figure 27.
Release from Deep Power-down (RDP) instruction sequence
C
DQ0
AI13745
S
2
1
3
4
5
6
7
0
t
RDP
Standby mode
Deep Power-down mode
DQ1
High Impedance
Instruction
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