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參數(shù)資料
| 型號： | LMX9820SB |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Bluetooth Serial Port Module |
| 中文描述： | 藍牙串行端口模塊 |
| 文件頁數(shù)： | 36/40頁 |
| 文件大小： | 567K |
| 代理商： | LMX9820SB |
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36
L
15.0 Soldering
The LMX9820 bumps are designed to melt as part of the
Surface Mount Assembly (SMA) process. The LMX9820 is
assembled with a high temperature solder alloy to ensure
there are no re-reflow conditions imposed upon the module
when reflowed to a PCB with these typical low temperature
60/40 (S = 183°C, L = 188°C), 62/36/2 (E = 179°C), or
63/37 (E = 183°C) solder alloys.
Where:
S: Solidus
– Denotes the points in a phase diagram representing
the temperature at which the solder composition be-
gins to melt during heating, or complete freezing dur-
ing cooling.
L: Liquidus
– Denotes the points in a phase diagram representing
the temperature at which the solder has molten com-
ponents. The temperature that melting starts at.
E: Eutectic
– Denotes solid to liquid without a plastic phase.
The low temperature solder alloy will reflow with the solder
bump and provide the maximum allowable solder joint reli-
ability.
Reflow at a peak of 215 --> 220°C (approximately 30 sec-
onds at peak) [not to exceed 225°C; measured in close
proximity of the modules] to avoid any potential re-reflow
conditions.
Table 39 and Figure 26 on page 37 provide the soldering
details required to properly solder the LMX9820 to stan-
dard PCBs. The illustration serves only as a guide and
National is not liable if a selected profile does not work.
Table 39. Soldering Details
Parameter
Value
PCB Land Pad Diameter
24 mil
PCB Solder Mask Opening
30 mil
PCB Finish (HASL details)
63/37 (difference in thickness < 28 micron)
Stencil Aperture
28 mil
Stencil Thickness
5 mil
Solder Paste Used
Low temperature 60/40 (S = 183°C, L = 188°C), 62/36/2 (E
= 179°C), or 63/37 (E = 183°C) solder alloys
1
Flux Cleaning Process
No Clean Flux System
1
Reflow Profiles
See Figure 26 on page 37
1.
Typically defined by customer.
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|---|---|
| LMX9820SBX | Bluetooth Serial Port Module |
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| LP3882ESX-1.5 | 1.5A Fast-Response Ultra Low Dropout Linear |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LMX9820SBX | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Bluetooth Serial Port Module |
| LMX9830 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:BluetoothTM Serial Port Module |
| LMX9830DONGLE | 功能描述:藍牙/802.15.1 開發(fā)工具 LMX9830 BLUETOOTH EVAL KIT RoHS:否 制造商:Panasonic Electronic Components 產(chǎn)品:Bluetooth Evaluation Kit 工具用于評估:PAN1721 頻率:2.4 GHz 接口類型:I2C 工作電源電壓:2 V to 3.6 V |
| LMX9830DONGLE/NOPB | 制造商:Texas Instruments 功能描述:Evaluation Kit For Bluetooth Serial Port Module |
| LMX9830SM | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:BluetoothTM Serial Port Module |
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