AC Electrical Characteristics, MCLK Dependent
(Continued)
The following specifications apply for AGND = DGND = DGND
= 0V, V
= V
= V
= +5.0V
, REF IN = +1.225V
DC
,
f
= 20MHz, t
= 1/f
, t
= t
f
= 5ns, R
= 25
, C
(databus loading) = 50 pF/pin. Refer to Table 2
. Configuration
Register Parameters
for limits labelled
C.R. Boldface limits apply for T
A
= T
J
= T
MIN
to T
MAX
; all other limits T
A
= T
J
=
25C.
Symbol
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 10)
Units
(Limits)
t
S/HREF
Falling Edge of
φ
1 to Ref. Sample
Either Edge of
φ
1 to Ref. Sample
Falling Edge of
φ
1 to Sig. Sample
Either Edge of
φ
1 to Sig. Sample
Sample Pulse Width
(Acquisition Time)
SYNC Low Between Lines
SYNC Setup of
φ
1 to End Line
CCLK Pulse Width
Data Valid Time from EOC Low
EOC Pulse Width
Standard CCD Mode
Even/Odd CCD Mode
Standard CCD Mode
Even/Odd CCD Mode
C.R.
ns
t
S/HSIG
C.R.
ns
t
S/HWIDTH
50ns
1
t
MCLK
t
SYNCLOW
t
B
t
CCLKWIDTH
t
DATAVALID
t
EOCWIDTH
100ns
2
2
5
t
MCLK
(min)
t
MCLK
(max)
t
MCLK
ns (min)
t
MCLK
Hz
Hz
%
250ns
300
5
f
MCLK
/
8
f
MCLK
/
16
50
250ns
2.5MHz
1.25MHz
φ
1 and
φ
2 Frequency
Standard CCD Mode
Even/Odd CCD Mode
φ
1 and
φ
2 Duty Cycle
Electrical Characteristics (Notes)
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test condi-
tions.
Note 2:
All voltages are measured with respect to GND = AGND = DGND = DGND
(I/O)
= 0V, unless otherwise specified.
Note 3:
When the input voltage (V
) at any pin exceeds the power supplies (V
<
GND or V
>
V
or V
), the current at that pin should be limited to 25 mA.
The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25
mA to two.
Note 4:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
,
θ
and the ambient temperature, T
. The maximum
allowable power dissipation at any temperature is P
= (T
–T
)/
θ
. T
= 150C for this device. The typical thermal resistance (
θ
JA
) of this part when board
mounted is 52C/W for the V52A PLCC package, and 70C/W for the VEG52A TQFP package.
Note 5:
Human body model, 100pF capacitor discharged through a 1.5 k
resistor.
Note 6:
See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any National Semiconductor
Linear Data Book for other methods of soldering surface mount devices.
Note 7:
A Zener diode clamps the OS analog input to AGND as shown below. This input protection, in combination with the external clamp capacitor and the output
impedance of the CCD, prevents damage to the LM9811 from transients during power-up.
Note 8:
To guarantee accuracy, it is required that V
A
and V
D
be connected together to the same power supply with separate bypass capacitors at each supply pin.
Note 9:
Typicals are at T
J
= T
A
= 25C, f
MCLK
= 20MHz, and represent most likely parametric norm.
Note 10:
Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
DS012813-4
www.national.com
6