- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3996 > KMC7457VG1000NC (Freescale Semiconductor)IC MPU RISC 32BIT 1000MHZ 483BGA PDF資料下載
參數(shù)資料
| 型號(hào)： | KMC7457VG1000NC |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 59/71頁(yè) |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 32BIT 1000MHZ 483BGA |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 1.0GHz |
| 電壓： | 1.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 483-BCBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 483-FCCBGA（29x29） |
| 包裝： | 托盤 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)當(dāng)前第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
System Design Information
Freescale Semiconductor
62
9.8.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 29 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 27). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure and is recommended due to the high power dissipation of the MPC7457. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially available thermal interfaces and adhesive
materials provided by the following vendors:
0
0.5
1
1.5
2
0
1020
304050
6070
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific
Th
er
ma
lResistance
(K-in.
2
/W
)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IDT70V27L25PF | IC SRAM 512KBIT 25NS 100TQFP |
| IDT70V27L20PF | IC SRAM 512KBIT 20NS 100TQFP |
| KMC7457RX1267LC | IC MPU RISC 32BIT 1267MHZ 483BGA |
| IDT7027L35PF | IC SRAM 512KBIT 35NS 100TQFP |
| IDT7027L25PF | IC SRAM 512KBIT 25NS 100TQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| KMC7457VG1267LC | 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KMC755CPX350LE | 功能描述:微處理器 - MPU 360PBGA RV2.8 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KMC755CRX350TE | 功能描述:微處理器 - MPU 360CBGA RV2.8 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KMC755CVT400LE | 功能描述:微處理器 - MPU GF RV2.8 4A 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KMC7D0CN20C | 制造商:KEC 制造商全稱:KEC(Korea Electronics) 功能描述:TSSOP-8 PACKAGE |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。