參數(shù)資料
型號： KIT33394DWBEVB
廠商： Freescale Semiconductor
文件頁數(shù)： 33/44頁
文件大小： 0K
描述： KIT EVAL FOR MC33394 8X PWR SPLY
標準包裝： 1
33394
39
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PACKAGE DIMENSIONS
DH SUFFIX
44–LEAD HSOP
PLASTIC PACKAGE
CASE 1291–01
ISSUE O
SEATING
PLANE
DATUM
PLANE
BOTTOM VIEW
A
X 45
E1
E
D
h
e
42X
B
M
bbb
C
44
23
22
1
E2
_
D2
D1
E3
A2
SECTION W–W
b
c1
b1
c
E4
A
M
aaa
C
EXPOSED
HEATSINK AREA
A
B
C
H
PIN ONE ID
22X
Y
GAUGE
PLANE
DETAIL Y
(1.600)
L
W
q
bbb C
L1
A1
0.325
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.150 PER SIDE. DIMENSIONS D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS –A– AND –B– TO BE DETERMINED AT
DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE TIEBAR
PROTRUSIONS. ALLOWABLE TIEBAR
PROTRUSIONS ARE 0.150 PER SIDE.
DIM
MIN
MAX
MILLIMETERS
A
3.000
3.400
A1
0.025
0.125
A2
2.900
3.100
D
15.800
16.000
D1
11.700
12.600
D2
0.900
1.100
E
13.950
14.450
E1
10.900
11.100
E2
2.500
2.700
E3
6.400
7.300
E4
2.700
2.900
L
0.840
1.100
L1
0.350 BSC
b
0.220
0.350
b1
0.220
0.320
c
0.230
0.320
c1
0.230
0.280
e
0.650 BSC
h
–––
0.800
q
0
8
aaa
0.200
bbb
0.100
__
E5
–––
1.000
D3
–––
1.000
D3
4X
E5
4X
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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