參數(shù)資料
型號: K4R571669D
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 256/288Mbit RDRAM(D-die)
中文描述: 256/288Mbit的RDRAM(深模)
文件頁數(shù): 4/20頁
文件大?。?/td> 311K
代理商: K4R571669D
Direct RDRAM
K4R571669D/K4R881869D
Page 2
Version 1.4 July 2002
COL
ROW
Pinouts and Definitions
Center-Bonded Devices
These tables shows the pin assignments of the center-bonded
RDRAM package. The mechanical dimensions of this
package are shown in a later section. Refer to Section
Center-Bonded WBGA Package
on page 18. Note - pin #1
is at the A1 position.
Table 1: Center-Bonded Device (top view)
10
V
DD
GND
V
DD
GND
V
DD
V
DD
V
DD
V
DD
GND
V
DD
9
8
GND
V
DD
CMD
V
DD
GND
GNDa
GNDa
V
DD
V
DD
GND
GND
V
DD
V
DD
GND
GND
V
CMOS
V
DD
GND
7
V
DD
DQA8
DQA7
DQA5
DQA3
DQA1
CTMN
CTM
RQ7
RQ5
RQ3
RQ1
DQB1
DQB3
DQB5
DQB7
DQB8
V
DD
6
5
4
GND
GND
DQA6
DQA4
DQA2
DQA0
CFM
CFMN
RQ6
RQ4
RQ2
RQ0
DQB0
DQB2
DQB4
DQB6
GND
GND
3
V
DD
GND
SCK
V
CMOS
GND
V
DD
GND
V
DDa
V
REF
GND
V
DD
GND
GND
V
DD
SIO0
SIO1
GND
V
DD
2
1
V
DD
GND
GND
V
DD
GND
GND
GND
GND
GND
V
DD
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
Chip
Top View
The pin #1(ROW 1, COL A) is located at the
A1 position on the top side and the A1 position
is marked by the marker
.
K4RXXXX69D-
F
xxx
SAMSUNG 230
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