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參數(shù)資料
| 型號： | ITF87056DQT |
| 廠商： | Intersil Corporation |
| 英文描述： | 5A, 20V, 0.045 Ohm, Dual P-Channel, 2.5V Specified Power MOSFET |
| 中文描述： | 第5A，20V的，0.045歐姆，雙P溝道，2.5V的指定功率MOSFET |
| 文件頁數(shù)： | 8/13頁 |
| 文件大?。?/td> | 226K |
| 代理商： | ITF87056DQT |
8
T
J2
= 156.5
o
C
The transient thermal impedance (Z
θ
JA
) is also affected by
varied top copper board area. Figure 21 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM5 remain constant for each of the thermal models. A
listing of the model component values is available in Table 1.
FIGURE 21. THERMAL IMPEDANCE vs MOUNTING PAD AREA
50
100
150
200
0
10
-1
10
0
10
1
10
2
10
3
t, RECTANGULAR PULSE DURATION (s)
Z
θ
J
,
COPPER BOARD AREA - DESCENDING ORDER
0.02 in
2
0.14 in
2
0.26 in
2
0.38 in
2
0.50 in
2
I
o
C
ITF87056DQT
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