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| 型號： | INTELDX4 |
| 廠商： | Intel Corp. |
| 英文描述： | Embedded Write-Back Enhanced Processor(32位回復(fù)嵌入式增強(qiáng)型處理器) |
| 中文描述： | 嵌入式回寫增強(qiáng)型處理器（32位回復(fù)嵌入式增強(qiáng)型處理器） |
| 文件頁數(shù)： | 48/50頁 |
| 文件大?。?/td> | 534K |
| 代理商： | INTELDX4 |
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Embedded Write-Back Enhanced IntelDX4 Processor
44
Table 23. Ceramic PGA Package Dimension Symbols
Letter or Symbol
A
A
1
A
2
A
3
B
D
D
1
e
1
L
S
1
Description of Dimensions
Distance from seating plane to highest point of body
Distance between seating plane and base plane (lid)
Distance from base plane to highest point of body
Distance from seating plane to bottom of body
Diameter of terminal lead pin
Largest overall package dimension of length
A body length dimension, outer lead center to outer lead center
Linear spacing between true lead position centerlines
Distance from seating plane to end of lead
Other body dimension, outer lead center to edge of body
NOTES:
1. Controlling dimension: millimeter.
2.
Dimension “e
1
” (“e”) is non-cumulative.
3. Seating plane (standoff) is defined by P.C. board hole size: 0.0415–0.0430 inch.
4. Dimensions “B”, “B
1
” and “C” are nominal.
5. Details of Pin 1 identifier are optional.
6.2
Package Thermal Specifications
The Embedded Write-Back Enhanced IntelDX4
processoris specified for operation when the case
temperature (T
) is within the range of 0°C to 85°C.
T
C
may be measured in any environment to
determine whether the processor is within the
specified operating range.
The ambient temperature (T
A
) can be calculated
from
θ
JC
and
θ
JA
from the following equations:
T
J
= T
C
+ P *
θ
JC
T
A
= T
J
- P *
θ
JA
T
C
= T
A
+ P * [
θ
JA
-
θ
JC
]
T
A
= T
C
- P * [
θ
JA
-
θ
JC
]
Where T
, T
, T
equals Junction, Ambient and
Case Temperature respectively.
θ
JC
,
θ
JA
equals
Junction-to-Case and Junction-to-Ambient thermal
Resistance, respectively. P is defined as Maximum
Power Consumption.
Values for
θ
and
θ
are given in the following
tables for each product at its maximum operating
frequencies. Maximum T
is shown for each product
operating at its maximum processor frequency (three
times the CLK frequency). Refer to the
Embedded
Intel486 Processor Family Developer’s Manual
(273021) for a description of the methods used to
measure these characteristics.
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