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參數(shù)資料
| 型號(hào)： | ICS853S012AKI |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時(shí)鐘及定時(shí) |
| 英文描述： | 853S SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC32 |
| 封裝： | 5 MM X 5 MM, 0.75 MM HEIGHT, MO-220VHHD-2, VFQFN-32 |
| 文件頁數(shù)： | 4/17頁 |
| 文件大小： | 2291K |
| 代理商： | ICS853S012AKI |
IDT / ICS LVPECL CLOCK/DATA MULTIPLEXER
12
ICS853S012AKI REV. A JANUARY 4, 2007
ICS853S012I
12:1, DIFFERENTIAL-TO-3.3V, 2.5V LVPECL CLOCK/DATA MULTIPLEXER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS83S012I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS83S012I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 70mA = 242.6mW
Power (outputs)
MAX
= 30.94mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) = 242.6mW + 30.94mW = 273.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no
air flow and a multi-layer board, the appropriate value is 34.8°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.274W * 34.8°C/W = 94.5°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA
vs. Air Flow (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
34.8°C/W
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
32 LEAD VFQFN, FORCED CONVECTION
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| ICS853S012AKILF | 功能描述:IC CLOCK/DATA MUX 12:1 32-VFQFN RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:HiPerClockS™ 產(chǎn)品培訓(xùn)模塊:High Bandwidth Product Overview 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
| ICS853S013AMILF | 功能描述:IC CLOCK BUFFER 1:3 2GHZ 20-SOIC RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:- 產(chǎn)品培訓(xùn)模塊:High Bandwidth Product Overview 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
| ICS853S014AGILF | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP |
| ICS853S014AGILFT | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFF 2:5 2GHZ 20TSSOP |
| ICS853S01AGILF | 制造商:Integrated Device Technology Inc 功能描述: |
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