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參數(shù)資料
| 型號(hào)： | ICS853S012AKI |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時(shí)鐘及定時(shí) |
| 英文描述： | 853S SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC32 |
| 封裝： | 5 MM X 5 MM, 0.75 MM HEIGHT, MO-220VHHD-2, VFQFN-32 |
| 文件頁數(shù)： | 2/17頁 |
| 文件大?。?/td> | 2291K |
| 代理商： | ICS853S012AKI |
IDT / ICS LVPECL CLOCK/DATA MULTIPLEXER
10
ICS853S012AKI REV. A JANUARY 4, 2007
ICS853S012I
12:1, DIFFERENTIAL-TO-3.3V, 2.5V LVPECL CLOCK/DATA MULTIPLEXER
PRELIMINARY
V
CC - 2V
50
50
RTT
Z
o = 50
Z
o = 50
FOUT
FIN
RTT =
Z
o
1
((V
OH + VOL) / (VCC – 2)) – 2
3.3V
125
125
84
84
Z
o = 50
Z
o = 50
FOUT
FIN
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are rec-
ommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminat-
ing resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
50
transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion.
Figures 4A and 4B show two different layouts which
are recommended only as guidelines. Other suitable clock lay-
outs may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
FIGURE 4B. LVPECL OUTPUT TERMINATION
FIGURE 4A. LVPECL OUTPUT TERMINATION
TERMINATION FOR 3.3V LVPECL OUTPUTS
EXPOSED PAD
Expose Metal Pad
(GROUND PAD)
GROUND PLANE
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
THERMAL VIA
SOLDER MASK
FIGURE 3. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
solder as shown in
Figure 3 For further information, please refer
to the Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
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| ICS853S012AKILF | 功能描述:IC CLOCK/DATA MUX 12:1 32-VFQFN RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:HiPerClockS™ 產(chǎn)品培訓(xùn)模塊:High Bandwidth Product Overview 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
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| ICS853S014AGILFT | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFF 2:5 2GHZ 20TSSOP |
| ICS853S01AGILF | 制造商:Integrated Device Technology Inc 功能描述: |
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