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參數(shù)資料
| 型號： | IBM25EMPPC740EBUF2000 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 36/43頁 |
| 文件大?。?/td> | 431K |
| 代理商： | IBM25EMPPC740EBUF2000 |
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Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
41 of 43
quately describe three-dimensional heat ow. The nal chip-junction operating temper-
ature is not only a function of the component-level thermal resistance, but the system-
level design and its operating conditions. In addition to the component's power dissipa-
tion, a number of factors affect the nal operating die-junction temperature. These fac-
tors might include air ow, board population (local heat ux of adjacent components),
heat sink efciency, heat sink attach, next-level interconnect technology, system air
temperature rise, etc.
8.0 Ordering Information
This section provides the part numbering nomenclature for the PPC740 and PPC750.
Note that the individual part numbers correspond to a maximum processor core fre-
quency. For available frequencies, contact your local IBM sales ofce.
In addition to the processor frequency and bus ratio, the part numbering scheme also
consists of a part modier. The part modier allows for the availability of future
enhanced parts (that is, lower voltage, lower power, higher performance, etc.).
Each part number also contains a revision code. This refers to the die mask revision
number and is specied in the part numbering scheme for identication purposes only.
provides the IBM part numbering nomenclature for the PPC740 and
PPC750.
Figure 23. IBM Part Number Key
Table 19 provides a list of part descriptions.
Table 19. PPC740 and PPC750 Part Descriptions
Product
Name
OEMLS Part
Number
CPU
Frequency
Package
PVR
DD
Level
Arthur (740)
IBM25EMPPC740E
BUF2000
200
21MM (255) CBGA
0X00080100
2.2
Arthur (740)
IBM25EMPPC740E
BUB2330
233
21MM (255) CBGA
0X00080100
2.2
PPC740 or PPC750 Family
IBM25EMPPC7XXXBUXXXX0
Package (BGA)
Revision Level (DD2.1)
(Contact Local IBM Sales Office for Available Bus Ratios)
Processor Frequency
Blank Digits
Applic. Conditions:
F = 2.5V
± 5%, 0 - 105C
Tray Shipping Container
B = 2.5 - 2.7V, 0 - 105C
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