參數(shù)資料
型號(hào)： IBM0116400
廠商： IBM Microeletronics
英文描述： 4M x 4 12/10 DRAM(16M位 動(dòng)態(tài)RAM（帶22條地址線，其中12條為行地址選通，10條為列地址選通）)
中文描述： 4米× 4 12月10日的DRAM（1,600位動(dòng)態(tài)隨機(jī)存儲(chǔ)器（帶22條地址線，其中12條為行地址選通，10條為列地址選通））
文件頁(yè)數(shù)： 27/28頁(yè)
文件大?。?/td> 512K
代理商： IBM0116400
IBM0116400
IBM0116400B IBM0116400P
4M x 4 12/10 DRAM
IBM0116400M
43G9396
SA14-4203-06
Revised 4/97
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 27 of 28
Revision Log
Revision
Contents Of Modification
03/15/94
Initial Release
09/06/94
1. Combine the 3.3V and the 5.0V specifications
2. Remove Test Address Compression
11/15/95
1. Iout changed to +2.0 mA and -2.0 mA in DC Electrical Characteristics table.
2. Packaging diagrams modified to clarify lead thickness and standoff height.
3. t
RPC
min changed from 0 to 5ns.
4. t
CHR
min changed from 20 to 10ns.
5. Currents in DC Electrical Characteristics table revised.
6. Test Modes and Test Circuit Diagram removed.
7. Rename t
ODD
to t
OED
.
8. t
OED,
t
CDD,
t
OEZ,
and t
OFF
min changed from 20 to 15ns, for the 70ns part.
9. t
RRH
min changed from 5 to 0ns for all speed sorts.
10. t
OEH
min changed from 20 to 15ns for the 70ns part.
11. t
CSR
min changed from 10 to 5ns for all speed sorts.
12. t
CAH
min changed from 15 to 10ns on 60 and 70ns parts.
13. t
OFF
max changed from 20 to 15ns for 70ns parts.
12/10/95
1. The Low Power and Standard Power Specifications were combined. ES# 43G9611 and ES# 43G9396 were
combined into ES# 43G9396.
2. Added Die Rev E part numbers.
3. t
DH
was reduced from 15ns to 12ns for the -60 speed sort.
4. t
CHD
was added to the Self Refresh Cycle with a value of 350
μ
s for all speed sorts.
5. The Self Refresh diagram was changed to allow CAS to go high t
CHD
after RAS falls entering a Self Refresh.
6. The CBR timing diagram was changed to allow CAS to remain low for back-to-back CBR cycles.
7. WE for the Hidden Refresh Write cycle in the Truth Table was changed from “L” to ” H”.
09/01/96
1. I
CC2
was changed from 2mA to 1mA.
2. I
I(L)
and I
O(L)
were altered from +/- 10uA to +/- 5uA.
3. t
T
was initially at a max of 30ns. It has been modified to 50ns for all speed sorts.
4. t
CPA
was decreased from 30ns to 28ns for the -50 speed sort.
5. t
RASP
max of 125K was raised to 200K for all speed sorts.
6. t
RP
was changed from 35ns to 30ns for the -50 speed sort.
03/19/97
1. WE for the Hidden Refresh Write cycle in the Truth Table was changed from “H” to “L
→
H”.
2. t
OED
was moved from the Common Parameters table to the Write Cycle Parameters Table.
3. t
ODD
in the CAS before RAS timing diagram was renamed t
OED
.
4. The -70 speed sort and timings were removed.
5. I
cc1
, I
cc3
, I
cc6
for the -50 speed sort were reduced from 85mA to 50mA.
6. I
cc4
for the -50 speed sort was reduced from 75mA to 25mA.
7. I
cc1
, I
cc3
, I
cc6
for the -60 speed sort were reduced from 75mA to 45mA.
8. I
cc4
for the -60 speed sort was reduced from 65mA to 25mA.
04/23/97
1. I
cc5
was changed from 200
μ
A to 100
μ
A for the Low Power Die Rev F Parts.
Discontinued (9/98 - last order; 3/99 last ship)
相關(guān)PDF資料
PDF描述
IBM0164165B 4M x 16 13/9 EDO DRAM(4M x 16 動(dòng)態(tài)RAM（超頁(yè)面模式讀寫(xiě)并帶22條地址線，其中13條為行地址選通，9條為列地址選通）)
IBM0164165P 4M x 16 13/9 EDO DRAM(4M x 16 動(dòng)態(tài)RAM（超頁(yè)面模式讀寫(xiě)并帶22條地址線，其中13條為行地址選通，9條為列地址選通）)
IBM0164405B 16M x 4 13/11 EDO DRAM(16M x 4 動(dòng)態(tài)RAM（超頁(yè)面模式并帶24條地址線，其中13條為行地址選通，11條為列地址選通）)
IBM0164405P 16M x 4 13/11 EDO DRAM(16M x 4 動(dòng)態(tài)RAM（超頁(yè)面模式并帶24條地址線，其中13條為行地址選通，11條為列地址選通）)
IBM01644F5B 16M x 8 13/11 Stacked DRAM(16M x 8 棧式動(dòng)態(tài)RAM（帶24條地址線，其中13條為行地址選通，11條為列地址選通）)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IBM0116405JIE60 制造商:IBM 功能描述:53H2588
IBM0116405PT1F60 制造商:IBM 功能描述:*
IBM01164B0T3F60 制造商:IBM 功能描述:51H0567
IBM01164D0T3F60 制造商:IBM 功能描述:51H0568
IBM0117400J1E70 制造商:IBM 功能描述:53H2508
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*