![](http://datasheet.mmic.net.cn/180000/HYM71V16755HCT8M-P_datasheet_11308767/HYM71V16755HCT8M-P_6.png)
PC100 SDRAM Unbuffered DIMM
Rev. 0.4/Dec. 01
7
HYM71V16755HCT8M Series
BYTE
NUMBER
FUNCTION
DESCRIPTION
FUNCTION
VALUE
NOTE
-8
-P
-S
-8
-P
-S
BYTE73
Manufacturer’s Part Number (Component)
7 (SDRAM)
37h
4, 5
BYTE74
Manufacturer’s Part Number (128Mb based)
131h
4, 5
BYTE75
Manufacturer’s Part Number (Voltage Interface)
V (3.3V, LVTTL)
56h
4, 5
BYTE76
Manufacturer’s Part Number (Memory Width)
131h
4, 5
BYTE77
....Manufacturer’s Part Number (Memory Width)
636h
4, 5
BYTE78
Manufacturer’s Part Number (Data Width)
737h
4, 5
BYTE79
....Manufacturer’s Part Number (Data Width)
535h
4, 5
BYTE80
Manufacturer’s Part Number (Refresh, SDRAM Bank)
5 (4K Refresh, 4Banks)
35h
4, 5
BYTE81
Manufacturer’s Part Number (Manufacturing Site)
H48h
4, 5
BYTE82
Manufacturer’s Part Number (Generation)
C43h
4, 5
BYTE83
Manufacturer’s Part Number (Package Type)
T54h
4, 5
BYTE84
Manufacturer’s Part Number (Component Configuration)
8 (x8 based)
48h
4, 5
BYTE85
Manufacturer’s Part Number (Module Revision)
M(1st Revision)
4Dh
4, 5
BYTE86
Manufacturer’s Part Number (Hyphent)
- (Hyphen)
2Dh
4, 5
BYTE87
Manufacturer’s Part Number (Min. Cycle Time)
8
P
S
38h
50h
53h
4, 5
BYTE88
~90
Manufacturer’s Part Number
Blanks
20h
4, 5
BYTE91
Revision Code (for Component)
Process Code
-
4, 6
BYTE92
....Revision Code (for PCB)
Process Code
-
4, 6
BYTE93
Manufacturing Date
Year
-
3, 6
BYTE94
....Manufacturing Date
Work Week
-
3, 6
BYTE95
~98
Assembly Serial Number
Serial Number
-
6
BYTE99
~125
Manufacturer Specific Data (may be used in future)
None
00h
BYTE126
System Frequency Support
100MHz
64h
7, 8
BYTE127
Intel Specification Details for 100MHz Support
Refer to Note7
AFh
ADh
7, 8
BYTE128
~256
Unused Storage Locations
-00h
Continued
Note :
1. The bank address is excluded
2. 1, 2, 4, 8 for Interleave Burst Type
3. BCD adopted
4. ASCII adopted
5. Basically Hynix writes Part No. except for ‘HYM’ in Byte 73~90 to use the limited 18 bytes from byte 73 to byte 90
6. Not fixed but dependent
7. CK0, CK2 connected to DIMM, TBD junction temp, CL2(3) support, Intel defined Concurrent Auto Precharge support
8. Refer to Intel SPD Specification 1.2B
9. In the case of L-Part, character ‘L’ will be added between byte 81 and byte 82.
10. Refer to HSI Web site.