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參數(shù)資料
| 型號(hào)： | HMMC-5200 |
| 元件分類： | 放大器 |
| 英文描述： | 0 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.0161 X 0.0181 INCH, DIE |
| 文件頁(yè)數(shù)： | 5/6頁(yè) |
| 文件大?。?/td> | 414K |
| 代理商： | HMMC-5200 |
5
Figure 5. Bonding Pad Positions
RF OUTPUT
RF INPUT
If 4.75V Vsupply 7V
RCC = 0
5V supply
Rout =
Rcc
*
[(Vsupply-3.2)*(1/0.028)]
RCC = [(Vsupply-6.5)*(1/0.01725)]
If Vsupply > 7V
Rout
Lchoke
Cblock
Note: For optimum performance,
the input and output bond wire
inductances should each be 0.1f0.3 nH.
(bond wire has about 20 pH/mil
of inductance).
Lchoke is optional if Rout is greater
than 300, however, gain will be
reduced by about 0.5 dB.
Note: Blocking Cap required on Input and Output
0
70
340
460
90
240
390
0
410
175
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