參數(shù)資料
型號(hào): HGTG15N120C3
廠商: HARRIS SEMICONDUCTOR
元件分類(lèi): 功率晶體管
英文描述: 35A, 1200V, UFS Series N-Channel IGBTs
中文描述: 35 A, 1200 V, N-CHANNEL IGBT, TO-247
文件頁(yè)數(shù): 10/11頁(yè)
文件大?。?/td> 139K
代理商: HGTG15N120C3
10
HGTG15N120C3, HGTP15N120C3, HGT1S15N120C3, HGT1S15N120C3S
TO-263AB
SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
LEAD NO. 1
-
GATE
LEAD NO. 3
-
EMITTER
TERM. 4
-
COLLECTOR
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
E
A
1
A
H
1
D
L
b
e
e
1
L
2
b
1
L
1
c
J
TERM. 4
1
3
1
1
3
L
3
b
2
TERM. 4
.450
(11.43)
.350
(8.89)
.150
(3.81)
.080(2.03)
.080(2.03)
.700
(17.78)
.062(1.58)
.062(1.58)
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.170
0.180
4.32
4.57
-
A
1
b
0.048
0.052
1.22
1.32
4, 5
0.030
0.034
0.77
0.86
4, 5
b
1
b
2
c
0.045
0.055
1.15
1.39
4, 5
0.310
-
7.88
-
2
0.018
0.022
0.46
0.55
4, 5
D
0.405
0.425
10.29
10.79
-
E
0.395
0.405
10.04
10.28
-
e
0.100 TYP
2.54 TYP
7
e
1
H
1
J
1
L
0.200 BSC
5.08 BSC
7
0.045
0.055
1.15
1.39
-
0.095
0.105
2.42
2.66
-
0.175
0.195
4.45
4.95
-
L
1
L
2
L
3
0.090
0.110
2.29
2.79
4, 6
0.050
0.070
1.27
1.77
3
0.315
-
8.01
-
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-263AB outline dated 2-92.
2. L
3
and b
2
dimensions established a minimum mounting surface
for terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L
1
is the terminal length for soldering.
7. Position of lead to be measured 0.120 inches (3.05mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 7 dated 10-95.
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