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| 型號： | HD64F2633R |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 51/67頁 |
| 文件大小： | 382K |
| 代理商： | HD64F2633R |
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Rev. 2.0, 03/06/02, 46
3.4
Setting Custom Build Phase Options
Once you have defined a custom phase, you will want to specify the command line options that should be used
when it is executed. Each defined phase has a menu option on the [Options] menu. To specify options for that
phase select it. The dialog that will be invoked depends upon whether the custom phase selected was a multiple
or single phase (according to the selection of phase type in figure 3.3b).
Figure 3.10: Custom Options Dialog
The dialog in figure 3.10 is a custom phase options dialog. The implementation of which is slightly different
depending on whether you are using a multiple or single shot phase. On the left-hand side is the project and file
list. It is possible to select multiple projects and files in the same way as Windows explorer to modify the
options for more than one selection. On the right-hand side are the 3 options tabs. This is where you set the
options that you want to apply to the selected file(s). You can also choose which configuration information is
being viewed from the configuration list on the upper left of the dialog box. Each configuration is listed along
with a special entry named “Multiple configurations…”. If you select multiple configurations then a dialog is
displayed which allows you to select more than one configuration. This method is used throughout HEW for
modifying multiple configurations at once.
3.4.1
Options Tab
The “Options” tab (figure 3.11) allows you to define the command line options that will be passed to the phase.
The “Command” field displays the command, which was entered when you defined the phase (figure 3.3d).
Enter into the “Options” field the command line arguments that you would like to pass to the command. If you
want to insert a placeholder, select the relevant placeholder from the “Placeholder” drop-down list box and then
click the “Insert” button. For a detailed description of placeholders see appendix C, “Placeholders” in the
Hitachi Embedded Workshop 2.1 User’s Manual.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F3024 | H8/3024 Series Hardware Manual |
| HD64F3026 | H8/3024 Series Hardware Manual |
| HD64F3028 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F3039 | Htachi Single-Chip Microcomputer H8/3039 Series H8/3039.H8/3038 H8/3037.H8/3036 H8/3039 F-ZTAT Hardware Manual |
| HD64F3039F | Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2633RF28 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 5V 128PQFP - Trays |
| HD64F2633RF28V | 制造商:Renesas Electronics 功能描述:16 H8S/2600 28MHz 128QFP 256KB Tray 制造商:Renesas Electronics Corporation 功能描述:Micro,H8S/2633,ROM 256k FL, RAM 16k 制造商:Renesas 功能描述:MCU 16-bit H8S CISC 256KB Flash 5V 128-Pin PQFP |
| HD64F2633RTE28 | 功能描述:IC H8S MCU FLASH 256K 120-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD64F2633RTE28V | 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays |
| HD64F2633TE16 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 120TQFP - Trays |
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