參數(shù)資料
型號(hào)： HD64F2633R
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機(jī)開(kāi)發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶(hù)手冊(cè)/交叉工具的性能
文件頁(yè)數(shù)： 30/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F2633R
Rev. 2.0, 03/06/02, 27
2.6.3
Stopping a Build
The Hitachi Embedded Workshop allows you to halt the build process.
To stop a build:
1. Select [Build->Stop Build] or click the stop build toolbar button (
). The build will be stop after the
current file has been built.
2. Wait until the message “Build Finished” appears in the “Output” window before continuing.
To forcibly terminate a current tool
1. Select [Build->Terminate Current Tool]. The HEW will attempt to stop the tool immediately.
Note:
Do NOT assume that any output from the tool you terminated is valid. It is recommended that you delete
any output files produced and ensure that the phase is executed again.
2.6.4
Building Multiple Projects
The Hitachi Embedded Workshop lets you build multiple projects and configurations at once.
To build multiple projects:
1.
Select [Build->Build Multiple]. The figure displayed in figure 2.18.
2.
The build multiple gives you the choice of which projects and configurations should be built. To select
which projects and configurations need to be built select the check box next to the project –
configuration combination you want to build. For example, in figure 2.18 if you wanted to build the
entire “hewtest2” project you would check the “hewtest2-Debug” and the “hewtest2-Release” selections
and leave all other check boxes unchecked.
3.
When you are happy with your chosen selection click the build button and the HEW will then build the
projects and configurations you have chosen.
4.
If you want to build all the projects which you choose, you click the build all button.
5.
Results from the build are displayed in the build window in the same way as the normal build process.
Figure 2.18: Build Multiple Dialog
相關(guān)PDF資料
PDF描述
HD64F3024 H8/3024 Series Hardware Manual
HD64F3026 H8/3024 Series Hardware Manual
HD64F3028 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F3039 Htachi Single-Chip Microcomputer H8/3039 Series H8/3039.H8/3038 H8/3037.H8/3036 H8/3039 F-ZTAT Hardware Manual
HD64F3039F Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2633RF28 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 5V 128PQFP - Trays
HD64F2633RF28V 制造商:Renesas Electronics 功能描述:16 H8S/2600 28MHz 128QFP 256KB Tray 制造商:Renesas Electronics Corporation 功能描述:Micro,H8S/2633,ROM 256k FL, RAM 16k 制造商:Renesas 功能描述:MCU 16-bit H8S CISC 256KB Flash 5V 128-Pin PQFP
HD64F2633RTE28 功能描述:IC H8S MCU FLASH 256K 120-TQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2633RTE28V 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays
HD64F2633TE16 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 120TQFP - Trays
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