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參數(shù)資料
| 型號： | HD64F2633R |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 50/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2633R |
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Rev. 2.0, 03/06/02, 45
3.3.2
Build File Phase Order
If you were to select a C source file from the “Workspace” window and then activate [Build->Build File] (or
press
) you would expect the file to be compiled. Likewise, if you were to select an assembly source file from
the workspace window and then activate [Build->Build File] you would expect the file to be assembled. The
connection between file group and which phase(s) to execute is managed by the “Build File Order” tab of the
“Build Phases” dialog (figure 3.9).
Figure 3.9: Build Phases Dialog Build File Order Tab
The list displays all of the current phases that will be executed when the build file operation is selected upon the
file group shown in the “File group” list box. In figure 3.9 the “C source file” file group is selected and the
“Compiler” and “MyPhase” phases are associated with it.
Entries in the “Phase order” list, of the “Build File Order” tab, are added automatically as new entries are added
to the “Build Order” tab. For example, if you were to add a phase which takes C source files as input then this
phase will be automatically added to the list of phases to execute when a build file operation is applied to a C
source file. If you don’t want a certain phase to execute when [Build->Build File] is selected then clear the
check box to the left of the phase name in the “Phase order” list.
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PDF描述 |
|---|---|
| HD64F3024 | H8/3024 Series Hardware Manual |
| HD64F3026 | H8/3024 Series Hardware Manual |
| HD64F3028 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F3039 | Htachi Single-Chip Microcomputer H8/3039 Series H8/3039.H8/3038 H8/3037.H8/3036 H8/3039 F-ZTAT Hardware Manual |
| HD64F3039F | Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2633RF28 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 5V 128PQFP - Trays |
| HD64F2633RF28V | 制造商:Renesas Electronics 功能描述:16 H8S/2600 28MHz 128QFP 256KB Tray 制造商:Renesas Electronics Corporation 功能描述:Micro,H8S/2633,ROM 256k FL, RAM 16k 制造商:Renesas 功能描述:MCU 16-bit H8S CISC 256KB Flash 5V 128-Pin PQFP |
| HD64F2633RTE28 | 功能描述:IC H8S MCU FLASH 256K 120-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD64F2633RTE28V | 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays |
| HD64F2633TE16 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 120TQFP - Trays |
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