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參數(shù)資料
| 型號： | HD64F2633R |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 48/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2633R |
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Rev. 2.0, 03/06/02, 43
3.3.1
Build Phase Order
The “Build Order” tab (figure 3.6) displays the current order in which phases will be executed when the build
(
) or build all (
) operation is selected. The check box to the left of each phase indicates whether or not it is
currently enabled. By clicking this box, the phase can be toggled on or off.
Figure 3.6: Build Phases Dialog Build Order Tab
In addition the following operations can be performed:
To remove a phase:
1. Select the phase that you would like to remove.
2. Click the “Remove” button.
To view the properties of a system phase:
1. Select the system phase that you would like to examine.
2. Click the “Modify…” button.
To move a phase:
1. Select the phase that you would like to move.
2.
Click the “Move Up” or “Move Down” button.
To import a phase:
1.
Click the import button. A dialog is displayed which allows the user to browse to an existing project to
import a custom phase from.
2.
Choose the location of the project you wish to import a custom phase from. Once selected a dialog is
displayed which lists the custom phases in the imported project.
3.
Selecting a phase name and then clicking properties displays the custom phase details. This allows you
to decide whether the phase does the functionality you require.
4.
Once you have decided which phase to import highlight it in the list and then click OK. The phase will
then be added to the build phases dialog at the bottom of the build order.
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| HD64F3024 | H8/3024 Series Hardware Manual |
| HD64F3026 | H8/3024 Series Hardware Manual |
| HD64F3028 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
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| HD64F3039F | Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2633RF28 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 5V 128PQFP - Trays |
| HD64F2633RF28V | 制造商:Renesas Electronics 功能描述:16 H8S/2600 28MHz 128QFP 256KB Tray 制造商:Renesas Electronics Corporation 功能描述:Micro,H8S/2633,ROM 256k FL, RAM 16k 制造商:Renesas 功能描述:MCU 16-bit H8S CISC 256KB Flash 5V 128-Pin PQFP |
| HD64F2633RTE28 | 功能描述:IC H8S MCU FLASH 256K 120-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 產(chǎn)品培訓模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD64F2633RTE28V | 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays |
| HD64F2633TE16 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 120TQFP - Trays |
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