參數(shù)資料
型號: HD64F2612
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù): 62/67頁
文件大小: 382K
代理商: HD64F2612
Rev. 2.0, 03/06/02, 56
3.9
Using an External Debugger
The Hitachi Embedded Workshop can launch an external debugger tool. If you want to use another debugger
then you must add it to the Tools menu (as described in chapter 5, “Customizing the Environment”, in the
Hitachi Embedded Workshop 2.1 User’s Manual).
The “Debugger” tab of the “Customize” dialog (figure 3.22) is where the Hitachi Debugging Interface related
information is configured. You may wish to use an older version of the debugger if certain targets are not
currently supported in the new environment. Invoke it by selecting [Tools->Customize…] and then selecting
the “Debugger” tab.
Figure 3.22: Customize Dialog Debugger Tab
When an external debugger is used, check ‘Use external debugger’ and then set the following items. Firstly, the
location of the HDI executable must be specified. This must be version 4.0 or greater otherwise the behavior is
not guaranteed. The second item of data is the session file. This tells HDI which session to load when it is
launched. Finally, the location of the download module is required. This allows the HEW to automatically
switch to HDI when the download module changes after a build.
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相關代理商/技術參數(shù)
參數(shù)描述
HD64F2612FA20J 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 80PQFP - Trays
HD64F2612FA20V 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設備:電容感應,DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設備:電容感應,DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述: