參數(shù)資料
型號(hào)： HD64F2612
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù)： 46/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F2612
Rev. 2.0, 03/06/02, 41
The fourth and final step (figure 3.3e) allows you to specify any environment variables, which the phase
requires.
Figure 3.3e: New Build Phase Dialog (Step 4)
To add a new environment variable click the “Add…” button (the dialog shown in figure 3.4 will be invoked).
Enter the variable name into the “Variable” field and the variable’s value into the “Value” field and then click
“OK” to add the new variable to the list of the fourth step. To modify an environment variables select the
variable in the list and then click the “Modify…” button. Make the required changes to the “Variable” and
“Value” fields and then click “OK” to add the modified variable to the list. To remove environment variables
select the variable that you want to remove from the list and then click the “Remove” button.
Figure 3.4: Environment Variable Dialog
If the tool you are adding can display its output as the tool is running then use the ‘Read Output On Fly’ option.
This will display the tool output as each line of output happens. If this option is set to off then the HEW will
store all output, which is being displayed by the tool, and display it in the output window when the tool has
finished its operation. This can be a problem when the tool is running an operation that might take many
minutes, as it is difficult to see the progress of the current execution.
Note:
Using ‘Read Output On Fly’ can cause problems when using certain tools on certain operating systems.
If you are having problems with tools locking up or freezing in HEW then uncheck the ‘Read Output On
Fly’ option.
Click the “Finish” button to create the new phase. By default the new phase is added to the bottom of the “Build
Phase Order” list in the “Build Order” tab of the “Build Phases” dialog (Figure ).
相關(guān)PDF資料
PDF描述
HD64F2612H Microcontroller
HD64F2623 H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A
HD64F2626 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2633 H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool
HD64F2633F16 Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2612FA20J 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 80PQFP - Trays
HD64F2612FA20V 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述:
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