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參數(shù)資料
| 型號(hào)： | HD64F2612 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能 |
| 文件頁數(shù)： | 2/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2612 |
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Rev. 2.0, 03/06/02, 1
1.
Overview
This chapter describes the fundamental concepts of the Hitachi Embedded Workshop. It is intended to give users
who are new to Windows extra help, filling in the details that are required by later chapters.
1.1
Workspaces, Projects and Files
Just as a word processor allows you to create and modify documents, the Hitachi Embedded Workshop allows
you to create and modify workspaces. A workspace can be thought of as a container of projects and, similarly, a
project can be though of as a container of project files. Thus, each workspace contains one or more projects and
each project contains one or more files. Figure 1.1 illustrates this graphically.
PROJECT
FILE
WORKSPACE
Figure 1.1: Workspaces, Projects and Files
Workspaces allow you to group related projects together. For example, you may have an application that needs
to be built for different processors or you may be developing an application and library at the same time. Projects
can also be linked hierarchically within a workspace, which means that when one project is built all of its “child”
projects are built first.
However, workspaces on their own are not very useful, we need to add a project to a workspace and then add
files to that project before we can actually do anything.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2612H | Microcontroller |
| HD64F2623 | H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A |
| HD64F2626 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2633 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2633F16 | Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2612FA20J | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 80PQFP - Trays |
| HD64F2612FA20V | 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays |
| HD64F2623FA20 | 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2623FA20J | 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2623FA20J/AU | 制造商:Renesas Electronics Corporation 功能描述: |
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