參數(shù)資料
型號(hào): GS8162Z72AC-300
廠商: GSI TECHNOLOGY
元件分類(lèi): SRAM
英文描述: 256K X 72 ZBT SRAM, 5 ns, PBGA209
封裝: 14 X 22 MM, 1 MM PITCH, BGA-209
文件頁(yè)數(shù): 31/36頁(yè)
文件大小: 889K
代理商: GS8162Z72AC-300
Rev: 1.03a 5/2003
4/36
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8162Z18A(B/D)/GS8162Z36A(B/D)/GS8162Z72A(C)
Preliminary
165 Bump BGA—x18 Commom I/O—Top View (Package D)
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10
11
ANC
AE1
BB
NC
E3
CKE
ADV
A
AA
BNC
AE2
NC
BA
CK
W
G
A
ANC
B
CNC
NC
VDDQ
VSS
VDDQ
NC
DQPA
C
DNC
DQB
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQA
D
ENC
DQB
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQA
E
FNC
DQB
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQA
F
GNC
DQB
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQA
G
HFT
MCH
NC
VDD
VSS
VDD
NC
ZQ
ZZ
H
J
DQB
NC
VDDQ
VDD
VSS
VDD
VDDQ
DQA
NC
J
K
DQB
NC
VDDQ
VDD
VSS
VDD
VDDQ
DQA
NC
K
L
DQB
NC
VDDQ
VDD
VSS
VDD
VDDQ
DQA
NC
L
M
DQB
NC
VDDQ
VDD
VSS
VDD
VDDQ
DQA
NC
M
N
DQPB
DNU
VDDQ
VSS
NC
VSS
VDDQ
NC
N
PNC
NC
A
ATDI
A1
TDO
A
ANC
P
RLBO
NC
A
ATMS
A0
TCK
A
AR
11 x 15 Bump BGA—13 mm x 15 mm Body—1.0 mm Bump Pitch
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