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參數(shù)資料
| 型號： | FXLA2203UMX |
| 廠商： | Fairchild Semiconductor |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | TRANSLATOR LEVEL DUAL 24UMLP |
| 標(biāo)準(zhǔn)包裝： | 5,000 |
| 應(yīng)用： | 用戶標(biāo)識模塊（SIM） |
| 電源電壓： | 1.65 V ~ 3.6 V |
| 封裝/外殼： | 24-UMLP |
| 供應(yīng)商設(shè)備封裝： | 24-UMLP |
| 包裝： | 帶卷 (TR) |
| 安裝類型： | 表面貼裝 |
2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FXLA2203 Rev. 1.0.5
15
FXLA2203
—
Dual-Mode,
Dual-S
IM-Card
Level
Translator
Physical Dimensions
TOP VIEW
BOTTOM VIEW
RECOMMENDED LAND PATTERN
0.10 C
0.08 C
B
A
C
0.10 C
2X
SIDE VIEW
SEATING
PLANE
0.10 C
0.05
0.00
7
13
1
0.10 C A B
0.05 C
0.55 MAX.
PIN #1 IDENT
19
2.50
3.40
0.40
0.15
0.25 24X
0.45
0.55
0.35
0.45
23X
0.15
24
3.70
2.80
2.23
1
7
13
19
24
0.40
0.56
0.23
0.66
Figure 18. 24-Terminal 2.5mm x 3.4mm Ultrathin Molded Leadless Package (UMLP)
Product-Specific Dimensions
Description
Nominal Values (mm)
Description
Nominal Values (mm)
Overall Height
0.50
Lead Length
0.40
PKG Standoff
0.012
Lead Pitch
0.40
Lead Thickness
0.15
Body Length (X)
2.50
Lead Width
0.20
Body Width (Y)
3.40
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packaging/MicroMLP24_TNR.pdf.
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