參數(shù)資料
型號: FDS6675
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: 小信號晶體管
英文描述: Single P-Channel, Logic Level, PowerTrenchTM MOSFET
中文描述: 11000 mA, 30 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET
封裝: SO-8
文件頁數(shù): 2/5頁
文件大?。?/td> 115K
代理商: FDS6675
Electrical Characteristics
(
T
A
= 25
O
C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
Conditions
Min
Typ
Max
Units
BV
DSS
BV
DSS
/
T
J
I
DSS
Drain-Source Breakdown Voltage
V
GS
= 0 V, I
D
= -250 μA
I
D
= -250 μA, Referenced to 25
o
C
-30
V
Breakdown Voltage Temp. Coefficient
-22
mV/
o
C
Zero Gate Voltage Drain Current
V
DS
= -24 V, V
GS
= 0 V
-1
μA
T
J
= 55°C
-10
μA
I
GSSF
I
GSSR
ON CHARACTERISTICS
(Note 2)
V
GS(th)
Gate Threshold Voltage
V
GS(th)
/
T
J
R
DS(ON)
Static Drain-Source On-Resistance
Gate - Body Leakage, Forward
V
GS
= 20 V, V
DS
= 0 V
V
GS
= -20 V, V
DS
= 0 V
100
nA
Gate - Body Leakage, Reverse
-100
nA
V
DS
= V
GS
, I
D
= -250 μA
I
D
= 250 μA, Referenced to 25
o
C
-1
-1.7
-3
V
Gate Threshold Voltage Temp. Coefficient
4.3
mV/
o
C
V
GS
= -10 V, I
D
= -11 A
0.011
0.014
T
J
=125°C
0.016
0.023
V
GS
= -4.5 V, I
D
= -9 A
V
GS
= -10 V, V
DS
= -5 V
V
DS
= -10 V, I
D
= -11 A
0.015
0.02
I
D(ON)
g
FS
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS
(Note 2)
t
D(on)
Turn - On Delay Time
t
r
Turn - On Rise Time
On-State Drain Current
-50
A
Forward Transconductance
32
S
V
= -15 V, V
GS
= 0 V,
f = 1.0 MHz
3000
pF
870
pF
360
pF
V
DS
= -15 V, I
D
= -1 A
V
GEN
= -10 V, R
GEN
= 6
12
22
ns
16
27
ns
t
D(off)
t
f
Q
g
Q
gs
Q
gd
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Drain-Source Diode Forward Current
V
SD
Drain-Source Diode Forward Voltage
Turn - Off Delay Time
50
80
ns
Turn - Off Fall Time
100
140
ns
Total Gate Charge
V
DS
= -15 V, I
D
= -11 A,
V
GS
= -5 V
30
42
nC
Gate-Source Charge
9
nC
Gate-Drain Charge
11
nC
-2.1
A
V
GS
= 0 V, I
S
= -2.1 A
(Note 2)
-0.72
-1.2
V
Notes:
1. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is
guaranteed by design while R
θ
CA
is determined by the user's board design.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
FDS6675 Rev.C1
c. 125
O
C/W on a 0.006 in
2
pad
of 2oz copper.
b. 105
O
C/W on a 0.04 in
2
pad of 2oz copper.
a. 50
O
C/W on a 1 in
2
pad
of 2oz copper.
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